Non-metal heat dissipation film and production equipment, manufacturing process

Abstract

The invention relates to a non-metallic heat dissipation film, production equipment and a manufacturing process. Including forming a ventilation gap on the non-metal high temperature resistant film; the two sides of the non-metal high temperature resistant film are respectively coated with thermally conductive nanomaterials to form a thermally conductive layer and coated with a thermally conductive nanomaterial to form a heat dissipation layer, and the heat of the thermally conductive layer is permeated through the ventilation gap. Conducted to the heat sink. The production equipment consists of a trough bracket, an unwinding roller and a rewinding roller pivoted at both ends, an extension wall protruding from the middle end, and a breathable gap die roller and a pressing roller pivoted along the pair of extending walls to butt against the pressing roller. The bottom drive roller, motor, and several guide rollers are arranged between the components of the groove bracket. Manufacturing process: On the film layer of the non-metallic film, a number of air-permeable gaps that allow heat to pass through are formed, and the film layer continues to form a roll without interruption; The nano-material coating is a heat-conducting layer and a heat-dissipating layer; the heat of the heat-conducting layer is transferred to the heat-dissipating layer through the ventilation gap.

Description

technical field [0001] The invention relates to the field of heat dissipation materials, in particular to a non-metal heat dissipation film, production equipment and manufacturing process. Background technique [0002] CN201010181772.1 discloses a heat radiation heat dissipation film structure and its manufacturing method. Its purpose is to provide a heat radiation heat dissipation film that can transmit heat in the direction of the substrate by means of heat radiation, which can greatly improve heat dissipation efficiency, making The heat radiation heat dissipation film structure in which the temperature of an external object located outside the substrate may not be lower than the temperature of the heat radiation heat dissipation film. The technical solution: the heat radiation heat dissipation film structure includes: a substrate having a first thermal expansion coefficient and electrical insulation; and a heat radiation heat dissipation film formed on the substrate and h...

AI Technical Summary

Problems solved by technology

[0008] Carbon nanotubes and graphene, materials with high thermal conductivity, can also be made into heat dissipation films, but the raw materials are expensive and the technology is immature

[0009] The various heat sinks and heat dissipation films mentioned above all have conductive properties, which will conduct electricity for some electronic components with conductive lines, which will easily cause short circuits, and the price ranges from several thousand yuan per square meter. A few hundred yuan per square meter cannot benefit general mass products, and only a few products with high unit prices can afford this kind of heat dissipation film

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