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Package lead frame

A technology for encapsulating leads and frames, which is applied in the direction of electrical components, electrical solid devices, circuits, etc. It can solve the problems of low yield, poor stability, and easy falling off of plastic packages and carriers for electronic components, achieving stable combination and shock resistance The effect of prolonging the sex and improving the bonding strength

Inactive Publication Date: 2013-12-25
SICHUAN JINWAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The problem to be solved by the present invention is how to provide a packaging lead frame, which can overcome the problem that the plastic package and the carrier sheet in the existing similar products are easy to fall off during the high-pressure water spraying process and the subsequent use process, resulting in electronic component products. Problems of low yield and poor stability

Method used

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Embodiment Construction

[0021] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0022] like Figure 3-8 As shown, the package lead frame is formed by continuous arrangement of several copper-based units, and each copper-based unit includes a heat sink 2, a carrier sheet 5, an inner lead 7 and an outer lead 8 connected in sequence; the heat sink 2 Positioning holes 1 are provided on the top; the connection between the heat sink 2 and the carrier 5 is a plane transition with the front of the carrier 5; the inner lead 7 and the outer lead 8 are plane transitions; the heat sink 2 and the carrier 5 A dovetail groove 3 is provided at the connection, and the dovetail groove 3 is arranged on the front of the copper-based unit; a U-shaped groove 4 is arranged on the front of the carrier 5; a V-shaped groove 6 is arranged on the inner lead 7, and the V-shaped Groove 6 is set on the front side of inner lead 7...

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Abstract

The invention discloses a package lead frame. The package lead frame is formed by sequential arrangement of a plurality of copper-based units. Each copper-based unit comprises a cooling fin, a ground slide, an internal lead and an external lead, wherein the cooling fin, the ground slide, the internal lead and the external lead are arranged in sequence and are connected into a whole. The package lead frame is characterized in that a dovetail groove is formed in the position where each cooling fin is connected with a corresponding ground slide, the dovetail grooves are formed in the front sides of the copper-based units, a U-shaped groove is formed in the front side of each ground slide, a V-shaped groove is formed in the front side of each internal lead, and gluing grooves are formed in the four peripheral edges of each ground slide. According to the package lead frame, gluing is achieved in the dovetail grooves between the cooling fins and the ground slides and the grooves in the periphery of the bottom surfaces of the ground slides, glue and the ground slides can be combined more stably and more firmly, then the bonding strength between plastic package bodies of electron components and the ground slides is improved, shock resistance of products is improved, and the service life of the products is prolonged.

Description

technical field [0001] The invention relates to the technical field of manufacturing semiconductor electronic components, in particular to a packaging lead frame. Background technique [0002] At present, semiconductor electronic components are usually assembled by chips, plastic package parts, gold wires or aluminum wires, lead frames, and the like. In order to improve the efficiency of automatic production, the lead frame is generally formed by a continuous arrangement of a plurality of identical copper-based units. In the assembly process, the chip 11 is first placed on the substrate of the copper-based unit by the core loading machine, and then it is completed through gold wire or aluminum wire bonding, packaging, high-pressure water spraying, surface electroplating, rib cutting and edge removal, and test classification. the whole process. [0003] like figure 1 and figure 2 As shown, a traditional lead frame includes a heat sink 2, a carrier 5, an inner lead 7 and ...

Claims

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Application Information

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IPC IPC(8): H01L23/495
Inventor 师成志肖前荣庞悦黄斌
Owner SICHUAN JINWAN ELECTRONICS
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