Preimpregnation material and laminated board
A prepreg, laminate technology, applied in the direction of layered products, metal layered products, synthetic resin layered products, etc., can solve the problems of cracked copper clad laminate insulation performance, affecting the insulation performance of copper clad laminates, etc., to improve bending resistance and fatigue resistance, improve mechanical properties and interlayer adhesion, and improve the effect of mechanical properties
Active Publication Date: 2014-01-01
GUANGDONG SHENGYI SCI TECH
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Problems solved by technology
However, carbon black is a conductive substance, and its addition will significantly affect the insulation performance of copper clad laminates.
[0005] As mentioned above, in the prior art, black particles such as carbon black are added to the thermosetting resin composition to give the copper clad laminate a black function, and the addi
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[0056] Example 1 uses reinforced material A for dipping, Example 2 uses reinforced material B for dipping, Example 3 uses reinforced material C for dipping, Example 4 uses reinforced material D for dipping, and Comparative Example 1 using reinforced material E for dipping. Comparative Example 2 adopts reinforced material F for dipping, and Comparative Example 3 adopts reinforced material G for dipping.
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Abstract
The invention discloses a preimpregnation material which comprises reinforcing materials and heat convertible resin composite materials, wherein the heat convertible resin composite materials are attached to the reinforcing materials after impregnation and drying are carried out, cladding processing is carried out on the reinforcing materials through oxidized graphene or graphene, and the oxidized grapheme or graphene is 0.01-5wt% of the reinforcing materials. According to the preimpregnation material, the reinforcing materials processed by the oxidized grapheme or graphene in the clad mode are added, and the light transmittance of a prepared copper clad substrate is greatly reduced on the premise that the insulativity of the prepared copper clad substrate is not reduced.
Description
technical field [0001] The invention relates to a prepreg and a laminated board. Background technique [0002] Metal foil clad board is a plate-shaped material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin solution, covering one or both sides with metal foil and hot pressing. It is called metal foil clad laminate ( Copper Clad Laminate, CCL), referred to as metal clad. Metal clad board is the substrate material for manufacturing printed circuit board (PCB for short), and PCB is one of the important components of the electronics industry. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed boards are used for the electrical interconnection between them. . The metal clad board is mainly responsible for the three functions of conductio...
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IPC IPC(8): C08K9/10C08L63/00C08J5/24B32B27/04B32B15/092
Inventor 柴颂刚苏晓声
Owner GUANGDONG SHENGYI SCI TECH
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