A high power semiconductor laser processing system
A processing system and semiconductor technology, used in semiconductor lasers, semiconductor devices, lasers, etc., can solve the problems of low processing efficiency, large volume, heavy weight, etc., and achieve the effect of good heat dissipation, good reliability and small size.
Active Publication Date: 2016-06-22
FOCUSLIGHT TECH
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Problems solved by technology
[0009] Lasers used in laser processing mainly include CO2 lasers and solid-state lasers. For laser processing equipment made of CO2 lasers and solid-state lasers, they are large in size and heavy in weight and cannot be portable. At the same time, laser processing equipment that uses CO2 lasers as light sources Can not be fully automatic, resulting in low processing efficiency
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[0029] Such as figure 1 As shown, the high-power semiconductor laser processing system of the present invention includes a housing, a semiconductor laser light source system 1, a protective window 3 and a heat dissipation system.
[0030] The semiconductor laser light source system is fixedly installed in the casing system, and the protective window is fixedly installed on the front end of the casing, keeping a proper gap with the light output part of the semiconductor laser light source system. The main body of the protective window is a double-layer flat plate structure, and the vacuum is filled between the two layers. The plate material can be selected from a material that matches the thermal expansion coefficient of the protective window installation frame. Usually the installation frame is made of metal with high thermal conductivity, so the double-layer plate can be made of quartz glass.
[0031] The semiconductor laser light source system includes a semiconductor lase...
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The invention provides a high-power semiconductor laser processing system. A clamping mechanism of a light beam focusing module of the high-power semiconductor laser processing system is fixedly installed on the inner bottom face of a casing through a radiating block, a sealed water cooling channel is arranged in the casing, and an annular water path is formed in the water cooling channel at the bottom of the casing from a water inlet to a water outlet and is mainly divided into a water inlet section, a bending portion A, a bending portion B and a water outlet section. The water inlet section and the water outlet section are located on two sides of the inside of the casing in parallel respectively, a channel bending in the radial direction of the light beam focusing module is arranged between the radiating block and the inner bottom face of the casing at the corresponding position to serve as the bending portion A to conduct radiating on the light beam focusing module, and the bending portion B is located at the front end head of the bending portion B and surrounds a protection window to conduct radiating on the protection window. The high-power semiconductor laser processing system is small in size, light in mass and good in radiating effect.
Description
technical field [0001] The invention relates to a semiconductor laser processing system (equipment). Background technique [0002] High-power semiconductor lasers have the advantages of small size, light weight, high efficiency, and long life. They have been widely used in laser processing, laser medical treatment, laser display, and scientific research. A wide range of comprehensive high-tech. [0003] Laser processing is mainly used for cutting, surface treatment, welding, marking and drilling, etc. Laser surface treatment includes laser phase transformation hardening, laser cladding, laser surface alloying and laser surface fusion. Laser processing technology mainly has the following unique advantages: [0004] (1) There is no "tool" wear during laser processing, and no "cutting force" acts on the workpiece; [0005] (2) It can process various metals and non-metals, especially materials with high hardness, high brittleness and high melting point; [0006] (3) The las...
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IPC IPC(8): B23K26/14B23K26/70H01S5/024B23K101/40
CPCB23K26/14B23K26/142B23K26/703B23K26/706H01S5/02423
Inventor 王敏刘兴胜蔡磊郑艳芳宋涛
Owner FOCUSLIGHT TECH