Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wet etching device

A wet etching and equipment technology, applied in the field of wet etching equipment, can solve problems such as transitional etching, product lamination, liquid level sensor false alarms, etc., to achieve the effect of reducing mura, preventing problems from occurring, and reducing the burden on personnel

Inactive Publication Date: 2014-01-22
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The influence of the liquid level in the liquid level tank 220 in normal film running is very important. When the real-time liquid level in the liquid level tank 220 reaches the corresponding liquid level, the sensor detects the liquid level, and a corresponding alarm will be issued. And if similar air bubbles or other unknown substances enter the pipeline, the liquid level in the liquid level tank 220 will be different from the liquid level in the machine 100, that is, the liquid level in the machine 100 is lower than the liquid level in the liquid level tank. Liquid level in 220, causing false alarms from level sensor 230
In turn, problems such as transitional etching and product lamination occur.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wet etching device
  • Wet etching device
  • Wet etching device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] The technical content of the present invention is further described below in conjunction with accompanying drawing and embodiment:

[0055] figure 2 A schematic structural diagram of a wet etching device according to a first embodiment of the present invention is shown. Specifically, specifically, such as figure 2 shown, with figure 1 Similar to the prior art shown, the wet etching equipment includes a machine 100 and a connecting pipeline 200 . Wherein, the machine 100 is filled with a chemical liquid, and the semiconductor device placed in the machine 100 is etched. The connecting pipeline 200 is connected to the bottom of the machine 100 and transmits the liquid medicine to the machine 100 . More specifically, the connecting pipeline 200 includes: a liquid-taking pipeline 210 , a liquid level tank 220 and a liquid level sensor 230 . The liquid-taking pipeline 210 communicates with the bottom of the machine 100 . The liquid level tank 220 is connected to the l...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
lengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a wet etching device. The wet etching device comprises a machine table and a connecting pipeline, wherein liquid medicine is contained in the machine table for etching a semiconductor device placed in the machine table; the connecting pipeline is connected to the bottom of the machine table and used for conveying the liquid medicine to the machine table; the connecting pipeline comprises a liquid getting pipeline, a liquid level slot and a liquid level sensor, wherein the liquid getting pipeline is communicated with the bottom of the machine table; the liquid level slot is connected on the liquid getting pipeline and used for dividing the liquid getting pipeline into a first pipeline and a second pipeline which are communicated from top to bottom; the first pipeline is arranged above the second pipeline; the liquid level slot is mutually communicated with the first pipeline and the second pipeline, and the liquid medicine is distributed from the second pipeline to flow to the first pipeline and the liquid level slot; the liquid level sensor is connected outside the liquid level slot; the wet etching device is characterized in that the wet etching device further comprises a filter device which is connected in the connecting pipeline.

Description

technical field [0001] The invention relates to the field of semiconductor device manufacturing, and in particular to a wet etching device. Background technique [0002] In recent years, organic EL display devices using organic electroluminescent (Electro Luminescence: hereinafter referred to as "organic EL") components have replaced CRT and LCD display devices and have been attracting attention. An organic EL display device of a thin film transistor (Thin Film Transistor: hereinafter referred to as "TFT") of an EL device. [0003] The organic EL components are sequentially stacked to form: the anode formed by transparent electrodes such as ITO (Indium Tin Oxide) and the like; the anode formed by MTDATA (4,4-bis(3-methylphenylaniline) A hole-transporting layer composed of a first hole-transporting layer such as TPD (4,4,4-tris(3-methylphenylanilino)triphenylamine) and a second hole-transporting layer such as TPD (Quinacridone ) derivative Bebq2 (10-benzo[h] hydroxyquinolin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/08H01L21/77
Inventor 陈睿黄于维林志明
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products