A double-sided thick copper plate and its manufacturing method
A production method and technology of thick copper plates, which are applied in the fields of printed circuit manufacturing, electrical components, printed circuits, etc., can solve problems such as weak line spacing, large difference in line width between upper and lower lines, and excessive etching burrs, so as to reduce the number of silk screen printing , reduce the amount of side erosion, and ensure the consistency of the effect
Active Publication Date: 2016-07-06
KINWONG ELECTRONICS TECH LONGCHUAN
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Problems solved by technology
[0007] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a double-sided thick copper board and a manufacturing method thereof, aiming to solve the problem of the large difference in line width between the upper and lower lines of the existing double-sided PCB board manufacturing method and the excessive etching burrs and line spacing. Problems of weak super-process capability and too many times of silk screen printing
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[0043] 1. Copper foil cutting:
[0044] If the copper thickness is required to be 12OZ, I just considered that the subsequent electroplating will thicken the copper by about 1OZ, so I will subtract 1OZ when selecting materials, that is, choose copper foil with a thickness of 11OZ, such as image 3 shown;
[0045] 2. Copper foil drill riveting holes and alignment holes:
[0046] That is, the riveting holes for pressing are drilled, the positions of the riveting holes of the two copper foils used for double-sided circuit lines are corresponding, and the positions of the alignment holes are staggered, such as Figure 4 shown;
[0047] 3. Line production:
[0048] This is defined as the production of the inner layer circuit, which is the same as the design of the outer layer circuit. For example, if the thickness of the finished copper is 12OZ, the inner layer production line is etched 6OZ, and the outer layer is etched 6OZ. Figure 5 As shown, it must be noted that this is th...
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The invention discloses a double-sided thick copper plate and a manufacturing method thereof, wherein the method comprises the steps of: S1, cutting copper foil; S2, drilling and riveting holes on the copper foil; S3, fabricating circuits on the copper foil; S4 , Riveting and pressing the two copper foils produced by the circuit; S5, continue to perform circuit production on the copper foil. Compared with the conventional process, the method of the present invention reduces the side etching amount and burr of the line, and ensures the consistency of the upper line width and the lower line width. After the copper foil produced by the first line is pressed, the line spacing has been Filling the dielectric layer, this part of the gap does not need to be filled with silk screen solder mask oil, which reduces the number of screen printing times and the quality risk brought by it.
Description
technical field [0001] The invention relates to the field of double-sided PCB board manufacturing, in particular to a double-sided thick copper board and a manufacturing method thereof. Background technique [0002] At present, the production process of double-sided PCB boards is generally as follows: use conventional copper-clad laminates, also known as CCL, cut them into sizes suitable for factory processing according to PCB processing requirements, and complete the processing according to the set process. That is to say, the double-sided panel processing process is: cutting-drilling-copper sinking-board electrical wiring-circuit making-drawing electrical wiring-etching, but this is generally only suitable for double-sided copper boards with small thickness. For double-sided thick copper boards above 6OZ, The following problems will occur if the conventional process is used, such as figure 1 : [0003] 1. After etching, the upper and lower line widths differ greatly, and...
Claims
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IPC IPC(8): H05K1/00H05K3/00
Inventor 张柏勇谭小林柯勇李仁荣
Owner KINWONG ELECTRONICS TECH LONGCHUAN