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Power components with composite heat sink

A technology of composite heat dissipation layer and power components, which is applied in the direction of semiconductor/solid-state device parts, electrical components, electric solid-state devices, etc., can solve the problems of high manufacturing cost, increase the volume of power components, and complicated installation process, so as to reduce the temperature rise , improve the service life, and the effect of uniform weight

Active Publication Date: 2017-12-29
GUANGDONG MENLO ELECTRIC POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the heat dissipation material is liquid metal with fluidity, the liquid metal must be packaged outside the power component with a casing, which increases the volume of the power component, and the installation process is complicated and the manufacturing cost is high.

Method used

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  • Power components with composite heat sink
  • Power components with composite heat sink
  • Power components with composite heat sink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment one, see figure 1 and figure 2 As shown, a compound heat dissipation layer for power components, the composite heat dissipation layer 2 is composed of a layer of insulating thin layer 21 and a layer of solid metal heat dissipation thin layer 22, the bottom layer of the composite heat dissipation layer 2 is an insulating thin layer 21, located in The bottom insulating thin layer 21 is used for close contact with the outer surface of the power component.

[0032] The insulating thin layer 21 is polyester film, polypropylene film, etc., and its thickness is between 0.001mm and 0.200mm.

[0033] The solid metal heat dissipation thin layer 22 is a metal aluminum thin layer, a metal silver thin layer, a metal zinc thin layer, a zinc aluminum alloy thin layer, etc., and its thickness is between 0.10 mm and 0.30 mm.

[0034] A power component with a composite heat dissipation layer, including a power component main body 1 and a composite heat dissipation layer 2, ...

Embodiment 2

[0038] Embodiment two, the difference with embodiment one is: see image 3 and Figure 4 As shown, the heat dissipation composite layer 2 includes more than two layers of insulating thin layers 21 and more than two layers of solid metal heat dissipation thin layers 22, and the insulating thin layers 21 and solid metal heat dissipation thin layers 22 are stacked alternately.

Embodiment 3

[0039] The third embodiment differs from the power component with a composite heat dissipation layer in the first embodiment in that it includes a power component main body with surface insulation, and at least one solid metal heat dissipation thin layer is provided on the outer surface of the power component main body. Since the surface of the main body of the power component itself is insulated, the insulating thin layer at the bottom of the composite heat dissipation layer can be omitted.

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Abstract

The invention relates to a power component composite heat dissipation layer and its technology and a power component with a composite heat dissipation layer. The composite heat dissipation layer is composed of at least one insulating thin layer and at least one solid metal heat dissipation thin layer. The bottom layer is an insulating thin layer, and the insulating thin layer located at the bottom layer is used for close contact with the outer surface of the power component. After this type of composite heat dissipation layer is combined with the power component, the surface of the power component is quickly formed with a heat dissipation composite thin layer composed of at least one insulating thin layer and at least one solid metal heat dissipation thin layer. The heat dissipation composite thin layer can be placed on the surface of the power component Form a heat dissipation layer with an arbitrary shape and a curved surface that fits the components, so that the weight of the product is uniform, and the traditional single-sided heat conduction is transformed into a multi-sided composite heat conduction by using the high thermal conductivity of the metal (traditionally, single-sided heat conduction is mainly used, and heat conduction is in all directions. Unbalanced), quickly and effectively conduct the heat generated by the device, reduce the temperature rise of the protected power components, and increase the service life of the power components.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to an improved heat dissipation structure of the power component, thereby effectively reducing the volume of the heat sink attached to the power component, improving the heat dissipation efficiency of the power component, and effectively protecting the power component from overheating damage. Composite heat dissipation layer for power components and its technology, and power components with composite heat dissipation layer. Background technique [0002] Today's power components are designed using technologies such as SOC (system on chip) \ SIP (system package) \ 3D_Pack (three-dimensional stacked package) \ Module (component), and the device density is getting higher and higher, and the demand for heat dissipation is increasing; the current The package of power components mainly adopts single-sided heat dissipation mode to transfer heat to the radiator, and use the rad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373H01L23/552H01L21/56
Inventor 孔星
Owner GUANGDONG MENLO ELECTRIC POWER
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