Line structure and manufacturing method thereof

Abstract

The invention discloses a line structure and a manufacturing method thereof. The line structure comprises an inner line layer, a first dielectric layer, a first conductive material layer, a second conductive layer, a second dielectric layer, a second conductive material layer and a third conductive layer. The first dielectric layer covers a first conductive layer of the inner line layer and is provided with a first surface and multiple first line trenches; the first conductive material layer is configured in the first line trenches; the second conductive layer is configured on the first surface and comprises a signal line and at least two reference lines; the second dielectric layer covers the first surface and the second conductive layer and is provided with a second surface and multiple second line trenches; the width of each first line trench and the width of each second line trench are smaller than the line width of each reference line; the second conductive material layer is configured in the second line trenches; and the third conductive material layer is configured on the second surface.

Description

technical field [0001] The invention relates to a circuit structure and a manufacturing method thereof, and in particular to a circuit structure with electromagnetic shielding effect and a manufacturing method thereof. Background technique [0002] With the progress of the printed circuit board (PCB) manufacturing technology, the size of the printed circuit board itself is getting smaller and smaller. Due to many design requirements, not only the number of circuit components arranged on the printed circuit board must be more and more, but also the signal transmission speed between the circuit components must be faster and faster. However, if a large number of circuit components are laid out in a limited circuit board area, the spacing between signal lines must be reduced, resulting in crosstalk between these signal lines, which will affect the Transmission quality. If the pitch of these signal lines is increased, the area where the actual circuit layout can be carried out ...

AI Technical Summary

Problems solved by technology

However, although there are components or protectors on the upper and lower sides of the signal line to avoid the spread of electromagnetic waves, the left and right sides of the signal line are essentially open spaces

Therefore, electromagnetic waves are easy to interfere with the signal transmission of the signal line from the left and right sides of the signal line, which means that the signal line is susceptible to electromagnetic wave interference, which in turn affects the integrity of signal transmission

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