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Welding assisting system with multiple hydrogen bonds and printed circuit board with welding assisting system

A technology of multiple hydrogen bonds and systems, applied in printed circuits, welding media, welding equipment, etc.

Inactive Publication Date: 2014-03-05
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The soldering consumable used for 01005 components is solder paste. The biggest challenge is the excellent printing of solder paste, while 3D assembly can directly use solder paste or solder paste, which also has more technical requirements for printability

Method used

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  • Welding assisting system with multiple hydrogen bonds and printed circuit board with welding assisting system
  • Welding assisting system with multiple hydrogen bonds and printed circuit board with welding assisting system
  • Welding assisting system with multiple hydrogen bonds and printed circuit board with welding assisting system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] This embodiment is solder paste, each component and content are as follows:

[0025]

Embodiment 2

[0027] This embodiment is solder paste, the alloy solder powder is Sn96.5Ag3.0Cu0.5, its content is 88% (mass percentage), and the content of solder paste is 12% (mass percentage).

[0028] The components and contents of the solder paste are as follows:

[0029]

[0030] Thoroughly mix the above alloy solder powder and solder paste evenly to prepare solder paste. The product should be refrigerated at 0-10 degrees Celsius.

Embodiment 3

[0032] This embodiment is solder paste, the solder alloy powder is Sn99Ag0.3Cu0.7, its content is 88% (mass percentage), and the content of solder paste is 12% (mass percentage).

[0033] The components and contents of the solder paste are as follows:

[0034]

[0035] Thoroughly mix the above alloy solder powder and solder paste evenly to prepare solder paste. The product should be refrigerated at 0-10 degrees Celsius.

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PUM

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Abstract

The invention relates to welding assisting chemicals, in particular to welding flux and welding paste for electronic device mounting, and a printed circuit board using the welding flux or welding paste to form welding points. The welding flux comprises solvent, resin, activating agent, thixotropic agent and the like. The welding paste is even paste with certain viscosity, good thixotropy and stable dynamics and is mechanically mixed by superfine (10-75 micrometers) spherical solder and the welding flux according to a certain proportion. When the thixotropic agent contains multiple hydrogen bond supramolecular self-assembly systems such as a double hydrogen bond system, a triple hydrogen bond system and a quadruple hydrogen bond system, the rheological performance of the welding flux or the welding paste can be increased, and printing quality can be improved.

Description

technical field [0001] The invention relates to soldering flux chemicals used in the electronic industry, in particular to flux paste and solder paste for electronic component installation. Background technique [0002] Since the 1970s and 1980s, the electronics industry represented by consumer electronics such as computers, communication equipment, and household appliances has developed rapidly. Now, with the emergence and rapid development of 3G technology, modern electronic products continue to integrate Digitalization and miniaturization development. High-density, small-volume packaging and assembly are the mainstream and development direction of Surface Mount Technology (SMT). For example, the use of 01005-type (0.40mm*0.20mm) components weighs 1 / of the 0201-type components. 2. The volume is 1 / 4 of the 0201 type, and its maximum mounting density can reach 600 components / cm 2 , which brings new challenges to the SMT industry, the most difficult link is the excellent p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/262B23K35/3613B23K35/362B23K2101/42
Inventor 黄艳罗骞陈群卢志云
Owner SICHUAN UNIV
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