Low-temperature epoxy adhesive for embedded steel bars and preparation method of adhesive
A technology of planting tendon glue and epoxy resin, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of unmentioned use temperature, unknown useability, low temperature performance research, etc., to achieve reasonable cost performance and applicable Long term and excellent construction performance
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Embodiment 1
[0058] A low-temperature epoxy planting glue, including component A and component B, specifically including the following components (by weight):
[0059]
[0060] The preparation method of the above-mentioned low-temperature epoxy planting reinforcement is as follows:
[0061] (1) Preparation of component A: Weigh the raw materials according to the above weight ratio, first mix 90.0 parts of bisphenol A epoxy resin, 10.0 parts of low viscosity bisphenol F epoxy resin, 10.0 parts of reactive diluent, 12.0 parts Add toughening agent 1, 0.5 parts of rheological additives, and 5.0 parts of thixotropic agent into the hydraulic disperser, stir at high speed for 1 hour, and finally add 8.0 parts of toughening agent 2 and 150.0 parts of filler, stir at medium speed for 0.5 hours and then leave material, packaged to obtain the finished product of component A;
[0062] (2) Preparation of component B: Weigh the raw materials according to the above weight ratio, add 40.0 parts of phe...
Embodiment 2
[0066] A low-temperature epoxy planting glue, including component A and component B, specifically including the following components (by weight):
[0067]
[0068] The preparation method of the above-mentioned low-temperature epoxy planting reinforcement is as follows:
[0069] (1) Preparation of component A: Weigh the raw materials according to the above weight ratio, first mix 85.0 parts of bisphenol A epoxy resin, 15.0 parts of low viscosity bisphenol F epoxy resin, 8.0 parts of reactive diluent, 8.0 parts of Add toughening agent 1, 1.5 parts of rheological additive, and 3.0 parts of thixotropic agent into the hydraulic disperser, stir at high speed for 1 hour, and finally add 15.0 parts of toughening agent 2 and 140.0 parts of filler, stir at medium speed for 0.5 hours and then discharge , packaged to obtain the finished product of component A;
[0070] (2) Preparation of component B: Weigh the raw materials according to the above weight ratio, add 30.0 parts of phenal...
Embodiment 3
[0074] A low-temperature epoxy planting glue, including component A and component B, specifically including the following components (by weight):
[0075]
[0076] The preparation method of the above-mentioned low-temperature epoxy planting reinforcement is as follows:
[0077] (1) Preparation of component A: Weigh the raw materials according to the above weight ratio, first mix 70.0 parts of bisphenol A epoxy resin, 30.0 parts of low viscosity bisphenol F epoxy resin, 5.0 parts of reactive diluent, 10.0 parts of Add toughening agent 1, 1.0 parts of rheological additive, and 2.0 parts of thixotropic agent into the hydraulic disperser, stir at high speed for 1 hour, and finally add 12.0 parts of toughening agent 2 and 120.0 parts of filler, stir at medium speed for 0.5 hours and then discharge , packaged to obtain the finished product of component A;
[0078] (2) Preparation of component B: Weigh the raw materials according to the above weight ratio, add 36.0 parts of phena...
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