Novel ternary thermal composite material and preparation method thereof

Abstract

The invention discloses a novel ternary thermal composite material and a preparation method thereof. The material comprises the following components in volume ratio: at least 15vol% and at most 30vol% of Cu, at least 70vol% and at most 85vol% of W+diamond, at least 70vol% (W+diamond) and less than 100vol% (W+diamond) of W, and more than 0vol% (W+diamond) and at most 30vol% (W+diamond) of diamond. The preparation method comprises the following steps: selecting the raw materials including W, Cu and diamonds, weighing in proportion, mixing by using planetary ball milling, and then sintering by using vacuum hot-pressing to obtain a compact W-Cu-Diamond ternary thermal composite material. The novel ternary thermal composite material has the advantages of high compactness, uniform and stable texture structure, light weight, excellent mechanical property and thermal property and adjustable thermal expansion coefficient; the preparation process is simple and good in repeatability.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a novel ternary thermal composite material with high thermal conductivity and adjustable coefficient of thermal expansion prepared by a hot pressing sintering method and a preparation method thereof. Background technique [0002] Cu has the characteristics of high plasticity, good electrical and thermal conductivity, etc. W has the advantages of high strength, high hardness, and low cost. Its thermal expansion coefficient is close to that of Si. The W-Cu composite material combines the excellent characteristics of the two and has high thermal conductivity. Electrical conductivity, ablation resistance, low thermal expansion coefficient and high strength are widely used in electrical contact materials, electronic packaging materials, electrode materials and special-purpose military materials. For example, in the field of electronic packaging, in order to make the W-Cu composite m...

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Problems solved by technology

For example, in the field of electronic packaging, in order to make the W-Cu composite material have a low thermal expansion coefficient matching that of silicon chips, gallium arsenide and ceramic materials, the current method of adjusting the thermal expansion coefficient is usually to select low-content Cu and high-content W. To prepare high-density W-Cu composite materials, low Cu content cannot ensure high thermal conductivity of the composite material, and at the same time increases the difficulty and complexity of the process, which in turn increases the difficulty of controlling the thermal expansion of the composite material, which limits the performance of W-Cu composite materials. The application of composite materials in this field, however, a new type of ternary thermal composite material W-Cu-Diamond with low expansion coefficient can be prepared under simple process conditions. It not only has the characteristics of light weight, excellent thermal and mechanical properties, but also has high Therefore, the preparation and research of this ternary composite material has certain significance

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