PCB

A PCB board and substrate technology, applied in the field of electronic devices, can solve problems such as difficult tinning and easy oxidation of PCB pads, and achieve the effects of easy tinning, avoiding pollution, and reducing electromagnetic radiation

Inactive Publication Date: 2014-03-19
WUXI JUNDA TESTING TECH SERVICES
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is: to provide a PCB board, by adding an anti-oxidation layer o

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB
  • PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Embodiment one, such as figure 1 As shown, a PCB board includes first to third substrates, one side of the first substrate 1 is provided with wiring layers, both sides of the second substrate 2 are provided with wiring layers, and the third substrate 3 is provided with wiring layers. A wiring layer is provided on one side, and the first to third substrates are tightly pressed in sequence, wherein, the side of the first substrate 1 without a wiring layer is pressed together with the side of the second substrate 2, and the first substrate 1 is provided with a wiring layer. One side of the wiring layer is provided with the first solder resist layer 4, the side of the third substrate 3 without the wiring layer is pressed against the other side of the second substrate 2, and the side of the third substrate 3 provided with the wiring layer is provided with the second resistance layer. Soldering layer 5; the first solder resist layer 4 and the second solder resist layer 5 are ...

Embodiment 2

[0026] Embodiment two, such as figure 2 As shown, a PCB board includes a substrate, the substrate is the same as the first to third substrates in Embodiment 1, both sides of the substrate include circuit wiring layers, and a solder resist layer is arranged on the wiring layers , the tin-sprayed layer or the gold-sprayed layer is set on the solder resist layer, the anti-oxidation layer is set on the tin-sprayed layer or the gold-sprayed layer, and the silk screen layer is set on the anti-oxidation layer. The setting of its anti-oxidation layer is the same as that of Embodiment 1.

[0027] The effect and principle of the anti-oxidation layer are as follows:

[0028] Because the gold layer is very thin during the gold plating and immersion gold process of the PCB, the gold layer is too thin, so it is not very dense during the crystallization process, leaving many micropores, which will become the origin of corrosion in the future. As a result, the bottom layer is corroded. Fro...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a PCB. The PCB comprises a substrate. The PCB comprises a circuit routing layer; the routing layer is provided with a welding blocking layer; the welding blocking layer is provided with a tin spraying layer or a gold spraying layer; the tin spraying layer or the gold spraying layer is also provided with an anti-oxidization layer; and the anti-oxidization layer is provided with a silkscreen layer. The anti-oxidization layer enables a welding pad on the PCB to be not easily oxidized and discolored and enables tinning to be easier so that the PCB welding pad is prevented from being damaged due to long-time heating. The anti-oxidization layer further comprises a soldering flux so that tinning is easier during a PCB welding process, the welding quality is improved, and the loss is reduced.

Description

technical field [0001] The invention discloses a PCB board, which belongs to the field of electronic devices. Background technique [0002] If the PCB board has been placed for a long time, the tinned pads on its surface are prone to oxidation and discoloration, and the gold-plated pads are prone to discoloration. During use, it will be difficult to tin the phenomenon. If you heat the tin for a long time, it is easy to damage the PCB board and discolor the metal ions. Effective isolation from oxygen in nature can solve the oxidation problem of metals, such as electroplating, oil spraying, painting, passivation, film protection, etc., can solve the oxidation problem of metal products after processing, but not Each process is suitable for the requirements of the PCB board. The cost of electroplating, oil spraying, and painting is high, and the inherent natural color of the metal cannot be reflected. It has a relatively large impact on the conductivity, welding performance, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K1/02
Inventor 周桃英王香兵唐豪
Owner WUXI JUNDA TESTING TECH SERVICES
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap