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An prepared method for a graphene composite and its preparation method for heat dissipation

A graphene composite, graphene technology, applied in chemical instruments and methods, carbon compounds, inorganic chemistry, etc., can solve the problems of inability to meet the design requirements of electronic products, high temperature of artificial graphite film preparation, thick thickness of natural graphite film, etc. Achieve excellent machinability, fast forming times, and reduced time and temperature

Active Publication Date: 2015-12-02
ZHANGJIAGANG KANGDE XIN OPTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of this, the object of the present invention is to provide a graphene composite film for heat dissipation to overcome the fact that the thick natural graphite film currently used cannot meet the design requirements of electronic products and the artificial graphite film has a high preparation temperature and serious energy consumption. The product defect that the price is too high; The present invention also provides a kind of method for preparing above-mentioned graphene composite film for heat dissipation

Method used

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  • An prepared method for a graphene composite and its preparation method for heat dissipation

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Embodiment 1

[0025] (1) Prepare 20 polyimide (PI) films, each PI film thickness between 20 μm; prepare sufficient solvent-based graphene slurry, the slurry pH value is 6.5, and the graphene specific surface area is 200m 2 / g, the average thickness of graphene is 5nm.

[0026] (2) Graphene coating is performed on the surface of each polyimide film to ensure uniform coating. The coated graphene thickness is between 15 μm.

[0027] (3) Lay the PI films pre-coated with graphene to form a laminate.

[0028] (4) Put the laminated body into an oven for baking, the baking temperature is 80° C., and the baking time is 1 h. After the solvent-based graphene coating is dried and cooled, the laminate can be taken out.

[0029] (5) Place the baked stack in a carbonization furnace, fix it with a graphite plate fixture, and apply a certain pressure to the stack. The carbonization temperature is set at 700 ° C, the carbonization time is 4 hours, and argon gas is introduced during carbonization. protect...

Embodiment 2

[0033] (1) Prepare 20 polyimide (PI) films, each PI film thickness is 20 μm; prepare sufficient solvent-based graphene slurry, the pH value of the slurry is 6.5, and the graphene specific surface area is 200m 2 / g, the average thickness of graphene is 5nm.

[0034] (2) Graphene coating is performed on the surface of each polyimide film to ensure uniform coating. The coated graphene thickness is between 15 μm.

[0035] (3) Lay the PI films pre-coated with graphene to form a laminate.

[0036] (4) Put the laminated body into an oven for baking, the baking temperature is 80° C., and the baking time is 1 h. After the solvent-based graphene coating is dried and cooled, the laminate can be taken out.

[0037] (5) Place the baked laminate in a carbonization furnace, fix it with a graphite plate fixture, and apply a certain pressure to the laminate. The carbonization temperature is set at 1000 ° C, the carbonization time is 4 hours, and argon gas is introduced during carbonization....

Embodiment 3

[0041] (1) Prepare 20 polyimide (PI) films.

[0042] (2) The surface of the polyimide film is not coated with graphene, but directly stacked.

[0043] (3) Place the laminated PI film in a carbonization furnace, fix it with a graphite plate fixture, and apply a certain pressure to the laminated body. The carbonization temperature is set at 1500 ° C, and the carbonization time is 7 hours. During carbonization, argon gas is introduced as protection. gas.

[0044] (4) Place the carbonized film in a graphitization furnace, press the film with a graphite block as described in (3), and carry out graphitization treatment, wherein the temperature of the graphitization treatment is 3000 ° C, the graphitization time is 10 h, and the graphite Argon gas was used as a protective gas during the chemical reaction.

[0045] (5) The finally prepared membrane material was tested according to the test standard ASTME1461-01, and the thermal conductivity obtained by the test was 1800 W / m·K.

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Abstract

The invention discloses a graphene composite film for heat dissipation and a preparation method thereof. Surfaces of multiply layers of polymer films are coated with graphene slurry in advance, the coated polymer films are placed in a stacked manner for baking, and the graphene composite film with high heat dissipation efficiency is prepared while carbonization and graphitization temperatures and time are reduced by the aid of high-temperature carbonization and graphitization under the nucleation induction action of the graphene in the carbonization and graphitization process. Compared with similar heat-dissipation graphite film materials in the market, the graphene composite film prepared with the method has the advantages that the preparation temperature is lower, the forming time is shorter, the energy consumption is lower, and the graphene composite film can be well applied to electronic devices, LED lamps and liquid crystal display products with high heat quantity and can well replace existing heat-dissipation film materials.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting materials, and in particular relates to a graphene composite film for heat dissipation and a preparation method thereof. Background technique [0002] As electronic products become increasingly intelligent and complex, the number of components required inside the product increases and the degree of integration becomes higher. The direct impact of this situation is that electronic products generate more and more heat during operation. If the heat is not discharged in time, it is easy to accumulate rapidly and form high temperature. The generation of high temperature will greatly reduce the performance, reliability and service life of these electronic products. Therefore, the electronic product industry has higher and higher requirements for heat dissipation materials as the core components of thermal control systems. Not only heat dissipation materials are required to have efficient heat ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01B31/04C01B32/194
Inventor 陈海力陈西宝
Owner ZHANGJIAGANG KANGDE XIN OPTRONICS MATERIAL
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