Self-repair conductive adhesive and preparation method thereof

A conductive adhesive and self-repair technology, applied in the field of conductive adhesive, can solve the problems of volume shrinkage, stress concentration, and affecting the strength repair rate of cracks, etc., to achieve the effect of improving strength, repairing conductive network, and good repair effect

Active Publication Date: 2014-03-26
JIANGSU RUIDE NEW ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the shortcoming of this kind of conductive adhesive is, in order to promote the release of epoxy resin and latent curing agent in the microcapsule powder after the microcapsule powder is destroyed, it is necessary to add more diluent in the microcapsule powder, and in self-healing During the curing process, the gradual volatilization of the diluent will cause volume shrinkage, and stress concentration will occur at the repaired crack, which will affect the repair rate of the strength of the repaired crack

Method used

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  • Self-repair conductive adhesive and preparation method thereof
  • Self-repair conductive adhesive and preparation method thereof
  • Self-repair conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3

[0035] Weigh epoxy diluent II, epoxy resin II, curing accelerator, emulsifier, deionized water and porous carbon material powder required for preparing microcapsule powder according to the mass given in Table 1, mix it, and grind , to form a uniform epoxy resin-porous carbon material powder emulsion; then heat the obtained epoxy resin-porous carbon material powder emulsion in a constant temperature water bath to 50-85°C and stir evenly, and then add the corresponding parts according to Table 1 The pre-polymerization solution of the capsule wall material is stirred evenly, and the deionized water is removed by centrifugal separation and vacuum drying to obtain microcapsule powder. Next, weigh microcapsule powder, epoxy diluent I, epoxy resin I, curing agent, flake silver powder, coupling agent according to the number of parts given in Table 2, and mix evenly at room temperature to obtain self-healing conductive adhesive .

Embodiment 4～6

[0037] According to the mass weighing given in Table 1, epoxy diluent II, epoxy resin II, curing accelerator, emulsifier, deionized water, spherical silver powder and porous carbon material powder required for preparing microcapsule powder are mixed, and grind to form a uniform epoxy resin-porous carbon material powder emulsion; then heat the obtained epoxy resin-porous carbon material powder emulsion in a constant temperature water bath to 50-85°C and stir evenly, and then add A corresponding amount of pre-polymerization liquid of capsule wall material is stirred evenly, and deionized water is removed through centrifugal separation and vacuum drying to obtain microcapsule powder. Next, weigh the microcapsule powder, epoxy diluent I, epoxy resin II, curing agent, flake silver powder, and coupling agent according to the parts given in Table 2, and mix them uniformly at room temperature to obtain a self-healing conductive adhesive .

[0038] The self-healing conductive adhesive...

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Abstract

The invention relates to a self-repair conductive adhesive which is composed of the following components in parts by weight: 100 parts of epoxy resin, 250-900 parts of flaky silver powder, 10-50 parts of curing agent, 10-40 parts of epoxy diluter, 3-20 parts of coupling agent and 3-18 parts of microcapsule powder. The microcapsule powder is composed of the following components in parts by weight: 100 parts of epoxy resin, 10-20 parts of curing accelerator, 35-80 parts of epoxy diluter, 0.5-3 parts of emulsifier, 50-300 parts of porous carbon powder, 200-600 parts of deionized water and 60-120 parts of capsule wall material. The invention also provides a preparation method of the conductive adhesive. The self-repair conductive adhesive comprises the microcapsule powder which contains the porous carbon powder, thereby avoiding generating stress concentration at the repaired crack, and enhancing the strength of the conductive adhesive after repair; and the porous carbon powder has high conductivity, and thus, also performs the function of repairing the conductive network at the crack.

Description

technical field [0001] The invention relates to conductive glue, in particular to a self-repairing conductive glue material and a preparation method thereof. Background technique [0002] As a development trend of conductive adhesives, self-healing conductive adhesives are of great significance because they can improve the reliability and service life of electrical conduction and expand the application fields of conductive adhesives. The Chinese patent with the publication number CN103191464A discloses a high-temperature self-healing conductive silver glue and its preparation method; After microcracks are generated inside, the microcracks extend through the microcapsule powder; the liquid epoxy resin containing nano-silver wire and latent curing agent in the microcapsule powder is released and filled into the cracks, and curing bonding cracks occur to reach the cracks and conductive network. double repair. But the shortcoming of this kind of conductive adhesive is, in orde...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J163/00C09J163/02C09J11/04C09J11/06C09J11/08
Inventor 戈士勇
Owner JIANGSU RUIDE NEW ENERGY TECH
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