Pre-manufacturing method and pre-manufactured structure for LED package

A technology of light-emitting diodes and pre-processing, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of easy embrittlement of the reflective base 60, damage to the packaging structure of light-emitting diodes, and reduced luminous efficiency, so as to reduce the damage rate , reduce production cost, increase the effect of contact area

Inactive Publication Date: 2014-03-26
CHANG WAH ELECTROMATERIALS INC +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, most of the existing reflective bases 60 are made of thermosetting materials. Therefore, the high temperature generated by the light-emitting diode chip after long-term operation cannot effectively conduct and dissipate heat through the reflective base 60. Therefore, the reflective base 60 is prone to The embrittlement phenomenon not only reduces the luminous efficiency, but also causes damage to the packaging structure of the LED for a long time, increasing the production cost

Method used

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  • Pre-manufacturing method and pre-manufactured structure for LED package
  • Pre-manufacturing method and pre-manufactured structure for LED package
  • Pre-manufacturing method and pre-manufactured structure for LED package

Examples

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Embodiment Construction

[0065] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the examples given are not intended to limit the present invention.

[0066] Such as figure 2 As shown, the reflective cup base material 200 which is copper foil is stamped 10 times to form more than two openings arranged in a rectangular array on the reflective cup base material 200 in the shape of a hollow cylinder or an indented bevel 201. Next, perform mechanical roughening 11 on the bottom surface of the reflective cup base material 200, so that a rough surface 202 is formed on the bottom surface of the reflective cup base material 200 to increase the contact area. Further chemical roughening 11' is carried out on the rough surface 202 (grinding by chemical polishing liquid, blackening and browning process by oxidant, and roughening operation ...

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Abstract

The invention discloses a pre-manufacturing method and a pre-manufactured structure for an LED package. The pre-manufactured structure of the LED package is manufactured mainly through the steps of stamping, coarsening, mold sealing, sticking, electroplating and the like. The pre-manufactured structure comprises a reflection cup rack, an insulation layer and a wire frame which are stuck together in sequence from the top down, wherein the reflection cup can resist high temperature generated by an LED in long-term operation, provides the superexcellent effects of heat conducting and extracting, and prolongs the service life of the LED; besides, the high-temperature-resist insulation layer ensures that the pre-manufactured structure can resist heat and is less susceptible to cracking and embrittling, thereby reducing the damage rate and use cost of the pre-manufactured structure of the LED package.

Description

technical field [0001] The invention relates to a pre-process method and structure of light-emitting diode packaging, in particular to a pre-process structure of light-emitting diode packaging produced by stamping, roughening, mold sealing, bonding, electroplating and other manufacturing technologies. Background technique [0002] With the advancement of science and technology and civilization, the production technology of light-emitting diodes is becoming more and more mature, and its application fields are quite extensive, which makes the market demand relatively increase. [0003] Such as figure 1 As shown, the packaging structure 6 of the existing light-emitting diode is composed of a reflective base 60 and a lead frame 61 that are in contact with each other up and down, and a light-emitting diode chip 62 is packaged on the lead frame 61 inside the reflective base 60. A metal reflective layer 63 is electroplated on the upper surface and inner sidewall of the reflective ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/60H01L33/62H01L33/48
CPCH01L2224/48091H01L2224/97H01L2924/00014H01L33/005H01L25/13H01L33/48H01L33/483H01L33/60H01L33/62H01L33/641
Inventor 黄嘉能
Owner CHANG WAH ELECTROMATERIALS INC
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