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Corrosion-resistant printed circuit board and its preparation method

A printed circuit board, corrosion-resistant technology, applied in the direction of printed circuit components, electrical connection printed components, printed components electrical connection formation, etc., to achieve good corrosion resistance and aging resistance, guaranteed pass rate, and improved corrosion resistance performance

Inactive Publication Date: 2016-08-17
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Resin is a macromolecular material, but there is no production process that uses resin to replace the solder bridge between gold fingers.

Method used

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  • Corrosion-resistant printed circuit board and its preparation method
  • Corrosion-resistant printed circuit board and its preparation method
  • Corrosion-resistant printed circuit board and its preparation method

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Embodiment Construction

[0031] The resin used in the embodiment of the present invention is epoxy resin, purchased from Sanei Chemical Co., Ltd.

[0032] The present invention will be further elaborated below in conjunction with the accompanying drawings and embodiments.

[0033] A method for preparing a corrosion-resistant printed circuit board, the printed circuit board includes a gold finger area and a circuit area, and the preparation method includes the following steps:

[0034] (1) Whole board electroplating: The printed circuit board after the previous process is electroplated to make the copper thickness reach 20-75mm (according to the customer's design requirements);

[0035] (2) Gold finger area production (refer to Figure 1-Figure 2 ):

[0036] ① Apply dry film 101, exposure and development, and etching to the printed circuit board obtained in step (1), and remove the copper between the gold fingers;

[0037] ②Fill epoxy resin 103 between the gold fingers, and grind the plate; first, d...

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Abstract

The invention discloses a manufacturing method of a corrosion-resistant printed wiring board. An outer layer of the printed wiring board comprises a golden finger area and a wiring area. The manufacturing method includes the following steps of (1) electroplating the whole board, (2) manufacturing the golden finger area, (3) attaching a dry film to cover the golden finger area and then manufacturing the wiring area and carrying out post-process manufacturing to obtain the corrosion-resistant printed wiring board. Resin is adopted to replace ink in the prior art to serve as a solder mask bridge to be filled between golden fingers. Because the resin has good corrosion resistance and ageing resistance, corrosion-resistant performance of the printed wiring board is greatly improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a corrosion-resistant printed circuit board and a preparation method thereof. Background technique [0002] With the continuous development of gold finger solder mask bridge, this process is also continuously applied to PCB products of medical sterilization equipment. However, with the continuous optimization of sterilization technology, the PCB products used in this sterilization device are also constantly challenged, and the biggest problem at present is the ink falling off between gold fingers. Due to the weak cross-linking degree of the ink, its unstable functional group is easy to react with the strong oxidant hydrogen peroxide in the disinfection process, resulting in weakened aging resistance and ink falling off. Finding new materials to replace the solder bridge between gold fingers has become a major breakthrough in solving the problem of corrosion resist...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40H05K1/11
Inventor 邱醒亚吴辉董浩彬
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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