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A laser beam splitting galvanometer scanning processing device

A technology of galvanometer scanning and processing devices, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of slow processing speed and low processing efficiency, and achieve improved processing efficiency, high processing speed and processing accuracy, The effect of improving the efficiency and quality of laser processing

Active Publication Date: 2016-09-07
张立国
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a laser beam splitting galvanometer scanning processing device, which solves the technical problems of low processing efficiency and slow processing speed of the laser processing device in the prior art

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  • A laser beam splitting galvanometer scanning processing device
  • A laser beam splitting galvanometer scanning processing device
  • A laser beam splitting galvanometer scanning processing device

Examples

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Embodiment 1

[0054] figure 1 It is a schematic diagram of the structure of the laser beam splitting galvanometer scanning processing device used in the laser dotting of the stainless steel light guide plate mask, as shown in figure 1 As shown: the stainless steel light guide plate mask laser marking device in this embodiment includes an incident beam 1, a beam control module, a laser beam splitting module 3 and a galvanometer scanning focusing unit, and the workpiece 14 to be processed is a stainless steel sheet with a thickness of 200 microns.

[0055]The beam control module includes a laser beam expander unit 2, and the galvanometer scanning focusing unit includes a scanning galvanometer and a scanning flat-field focusing mirror. The scanning flat-field focusing mirror has types such as an ordinary flat-field scanning focusing mirror and a telecentric flat-field scanning focusing mirror. In this embodiment, the scanning flat-field focusing mirror adopts a telecentric flat-field scanning ...

Embodiment 2

[0062] figure 2 It is a schematic diagram of the structure of a laser beam splitting galvanometer scanning processing device of the present invention when it is applied in silicon wafer drilling, as figure 2 As shown: it includes a beam control module, a laser beam splitting module and a galvanometer scanning focusing module. The workpiece 34 to be processed is a polysilicon wafer with a thickness of 200 microns, and is fixedly installed on a linear mobile platform.

[0063] The beam control module of this embodiment includes a laser beam expansion unit 19 and a beam dynamic control unit.

[0064] The incident beam 18 of the present embodiment is an incident beam expansion collimated beam with a diameter of 10 millimeters, and its relevant parameters are as follows: the laser wavelength is 532 nanometers, the beam quality factor is less than 1.2, the roundness of the light spot is greater than 90%, and the average power is 35 watts , single-mode Gaussian laser (transverse f...

Embodiment 3

[0075] Such as image 3 As shown, it is a schematic structural diagram of the application of a laser beam splitting galvanometer scanning processing device in the present invention to drill holes in a stainless steel filter, including a beam control module, a laser beam splitting module and a galvanometer scanning focusing module. The workpiece to be processed 54 For 100 micron thickness stainless steel sheet.

[0076] The incident beam is an incident beam expansion collimated beam with a diameter of 10 mm, and its related parameters are as follows: laser wavelength 532 nm, beam quality factor less than 1.2, spot circularity greater than 90%, average power 30 watts, single-mode Gaussian laser (transverse field strength is Gaussian distribution), pulse repetition frequency 100 kHz.

[0077] The beam control module of this embodiment includes a laser beam expansion unit 38 and a beam dynamic control unit. The beam dynamic control unit includes a first incident beam control uni...

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Abstract

The invention relates to the field of laser processing, in particular to a laser splitting galvanometer scanning and processing device comprising a beam control module, a laser splitting module, and a galvanometer scanning and focusing module. The laser splitting module is capable of processing a single laser beam into multiple laser beams, and the galvanometer scanning and focusing module is capable of switching laser focuses at high speed; by combining the two modules, high-speed efficient precision array laser processing is achieved; beam motion track control contents in laser processing can be further enriched by adding the beam control module, and the needs of various processing environments and various conditions are met. Compared to traditional laser processing, the laser splitting galvanometer scanning and processing device has the advantages that all aspects such as processing precision, processing efficiency and processing quality are greatly improved, the device adapts to the development trend of modern solid-state lasers and the device is widely applicable to the field of laser processing.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a laser beam splitting galvanometer scanning processing device. Background technique [0002] In the prior art, laser processing devices equipped with galvanometer scanning and focusing all use single-beam laser processing, and the processing efficiency is not high enough to meet industrial needs; while devices using multi-beam laser processing are all based on static focusing methods, there are The problem that the laser focus switching position is slow. However, the current solid-state lasers, especially fiber lasers, are developing towards high pulse repetition frequency and high-power ultra-short pulse width. With the advantages of high pulse repetition frequency and high-power ultra-short pulse width of lasers, a more efficient laser processing method must be found to match the current level of laser development. Contents of the invention [0003] The technical problem to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/064B23K26/082
CPCB23K26/064B23K26/0643B23K26/0648B23K26/0652B23K26/0676B23K26/082B23K26/707
Inventor 张立国
Owner 张立国