A laser beam splitting galvanometer scanning processing device
A technology of galvanometer scanning and processing devices, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of slow processing speed and low processing efficiency, and achieve improved processing efficiency, high processing speed and processing accuracy, The effect of improving the efficiency and quality of laser processing
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Embodiment 1
[0054] figure 1 It is a schematic diagram of the structure of the laser beam splitting galvanometer scanning processing device used in the laser dotting of the stainless steel light guide plate mask, as shown in figure 1 As shown: the stainless steel light guide plate mask laser marking device in this embodiment includes an incident beam 1, a beam control module, a laser beam splitting module 3 and a galvanometer scanning focusing unit, and the workpiece 14 to be processed is a stainless steel sheet with a thickness of 200 microns.
[0055]The beam control module includes a laser beam expander unit 2, and the galvanometer scanning focusing unit includes a scanning galvanometer and a scanning flat-field focusing mirror. The scanning flat-field focusing mirror has types such as an ordinary flat-field scanning focusing mirror and a telecentric flat-field scanning focusing mirror. In this embodiment, the scanning flat-field focusing mirror adopts a telecentric flat-field scanning ...
Embodiment 2
[0062] figure 2 It is a schematic diagram of the structure of a laser beam splitting galvanometer scanning processing device of the present invention when it is applied in silicon wafer drilling, as figure 2 As shown: it includes a beam control module, a laser beam splitting module and a galvanometer scanning focusing module. The workpiece 34 to be processed is a polysilicon wafer with a thickness of 200 microns, and is fixedly installed on a linear mobile platform.
[0063] The beam control module of this embodiment includes a laser beam expansion unit 19 and a beam dynamic control unit.
[0064] The incident beam 18 of the present embodiment is an incident beam expansion collimated beam with a diameter of 10 millimeters, and its relevant parameters are as follows: the laser wavelength is 532 nanometers, the beam quality factor is less than 1.2, the roundness of the light spot is greater than 90%, and the average power is 35 watts , single-mode Gaussian laser (transverse f...
Embodiment 3
[0075] Such as image 3 As shown, it is a schematic structural diagram of the application of a laser beam splitting galvanometer scanning processing device in the present invention to drill holes in a stainless steel filter, including a beam control module, a laser beam splitting module and a galvanometer scanning focusing module. The workpiece to be processed 54 For 100 micron thickness stainless steel sheet.
[0076] The incident beam is an incident beam expansion collimated beam with a diameter of 10 mm, and its related parameters are as follows: laser wavelength 532 nm, beam quality factor less than 1.2, spot circularity greater than 90%, average power 30 watts, single-mode Gaussian laser (transverse field strength is Gaussian distribution), pulse repetition frequency 100 kHz.
[0077] The beam control module of this embodiment includes a laser beam expansion unit 38 and a beam dynamic control unit. The beam dynamic control unit includes a first incident beam control uni...
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Abstract
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