Assembling and packaging system and method of sensor
A packaging system and sensor technology, applied in the direction of instruments, microstructure devices, processing microstructure devices, etc., can solve the problems of unguaranteed alignment assembly quality, high requirements for operators, and low work efficiency, so as to reduce requirements and realize automation , the effect of improving work efficiency
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[0040] The non-planar assembly method of the MEMS sensor is: first manually complete the alignment assembly with the support of the vision system, and then transfer it to the packaging equipment for packaging. Because the production of MEMS sensors is different from general micro-assembly, it is an integration of the two processes of micro-assembly and packaging, which requires high operators and low work efficiency. Since the assembled MEMS sensor is not fixed during the transfer process, the quality of the alignment assembly cannot be guaranteed, which reduces the yield.
[0041] In view of the shortcomings in the prior art, the present invention provides a sensor assembly and packaging system and assembly and packaging method. The system integrates equipment such as a microscope, a manipulator, and a bonding process platform. The application of the system can realize complex MEMS microstructures for automation. The integrated operation of alignment, assembly and packaging proc...
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