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Assembling and packaging system and method of sensor

A packaging system and sensor technology, applied in the direction of instruments, microstructure devices, processing microstructure devices, etc., can solve the problems of unguaranteed alignment assembly quality, high requirements for operators, and low work efficiency, so as to reduce requirements and realize automation , the effect of improving work efficiency

Active Publication Date: 2014-04-16
SUZHOU SUXIANG ROBOT INTELLIGENT EQUIP CO LTD
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. High requirements for operators and low work efficiency
[0005] 2. Since the assembled MEMS sensor is not fixed during the transfer process, the quality of the alignment assembly cannot be guaranteed, which reduces the yield

Method used

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  • Assembling and packaging system and method of sensor
  • Assembling and packaging system and method of sensor

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Embodiment Construction

[0040] The manufacturing method of non-planar assembly of MEMS sensor is: first, the alignment assembly is manually completed with the support of the vision system, and then transferred to the packaging equipment for packaging. Because the production of MEMS sensors is different from general micro-assembly, it is the integration of micro-assembly and packaging processes, which has high requirements for operators and low work efficiency. Since the assembled MEMS sensor is not fixed during the transfer process, the quality of alignment assembly cannot be guaranteed, which reduces the yield.

[0041] Aiming at the deficiencies in the prior art, the present invention provides a sensor assembly and packaging system and an assembly and packaging method. The system integrates equipment such as a microscope, a manipulator, and a bonding process platform. The application of this system can realize automatic processing of complex MEMS microstructures. The integrated operation of alignme...

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Abstract

The invention discloses an assembling and packaging system and method of a sensor. The system integrates equipment of microscopes, a manipulator, a bonding technological platform and the like; the manipulator is controlled to operate by a control mechanism; firstly, a pipe seat is placed on the bonding technological platform to fix; then a chip is installed on the pipe seat; and finally, the bonding packaging is realized. The postures of the pipe seat and the chip are confirmed by adopting the two microscopes respectively, and the automatic alignment and assembling between the chip and the pipe seat are realized; the requirement for operators in the process of manufacturing the sensor is lowered; the working efficiency is improved; meanwhile the effective positioning between the chip and the pipe seat is ensured; the finished product rate is improved; and the integrated operation of the assembling and bonding packaging of sensor components is realized on the same machine for a complex MEMS (micro-electromechanical systems) micro structure by applying the system so as to reach the automation of sensor production.

Description

technical field [0001] The invention belongs to the technical field of MEMS assembly and packaging, and in particular relates to a sensor assembly and packaging system and an assembly and packaging method. Background technique [0002] MEMS sensor is a new type of sensor manufactured by microelectronics and micromachining technology. Compared with traditional sensors, it has the characteristics of small size, light weight, low cost, low power consumption, high reliability, suitable for mass production, easy integration and intelligentization. At the same time, the feature size on the order of microns enables it to complete some functions that cannot be realized by traditional mechanical sensors. [0003] During the manufacturing process of the MEMS sensor, the sensor chip needs to be assembled with the stem (or substrate), and then packaged. The current assembly is common from the plane of the chip to the plane of the socket (or substrate), and generally does not involve n...

Claims

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Application Information

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IPC IPC(8): B81C3/00
Inventor 潘明强刘吉柱王阳俊陈涛孙立宁陈立国
Owner SUZHOU SUXIANG ROBOT INTELLIGENT EQUIP CO LTD
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