Flexible circuit substrate double-sided light-emitting LED array light source

A flexible circuit substrate, LED array technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of poor light extraction efficiency and low light source utilization rate, and achieve the goal of improving conversion efficiency, high degree of automation, and improved light extraction efficiency Effect

Inactive Publication Date: 2014-04-30

SUZHOU JINGPIN OPTOELECTRONICS

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AI-Extracted Technical Summary

Problems solved by technology

[0005] In order to solve the problems in the prior art that the LED light source emits light from one side, the light output efficiency is poor, and the utilization rate of the light source is low, the present invention provides a method that fully utilizes the PN junction of the LED chip t...

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Method used

[0032] The flexible planar transparent circuit substrate 1 has certain characteristics such as solder resistance, frivolity, and mechanical strength. The flexible planar transparent circuit substrate 1 adopts one of transparent polyester film, polyimide film and PMMA. And the material of the fle...

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Abstract

The invention discloses a flexible circuit substrate double-sided light-emitting LED array light source. The flexible circuit substrate double-sided light-emitting LED array light source comprises a plurality of LED chips. The flexible circuit substrate double-sided light-emitting LED array light source is characterized in that the flexible circuit substrate double-sided light-emitting LED array light source further comprises a flexible flat transparent circuit substrate, a conductive pattern and a fluorescent film; one side of the flexible flat transparent circuit substrate is provided with the conductive pattern; binding regions are reserved on the conductive pattern; the LED chips are directly arranged on the binding regions in a surface-mount manner and are communicated with one another through the conductive pattern; and the fluorescent film is arranged on the LED array such that the LED chips can be entirely encapsulated. With the flexible circuit substrate double-sided light-emitting LED array light source of the invention adopted, problems of low light-emitting efficiency and low light source utilization rate, which are caused by single-sided light emission of an LED light source in the prior art, can be solved; and the LED chips can be protected, and at the same time, PN junctions of the LED chips can be fully utilized to emit light; and advantages of a plane array source light can be utilized, and therefore, heat dissipation capacity can be improved, and cost and weight of a heat sink and a radiator can be omitted. Thus, the flexible circuit substrate double-sided light-emitting LED array light source is advantageous in improved light-emitting efficiency and improved utilization rate.

Application Domain

Solid-state devicesSemiconductor devices

Technology Topic

FluorescenceLight source +7

Image

Examples

Experimental program(1)

Example Embodiment

[0028] The present invention will be further described below in conjunction with the drawings.

[0029] Such as Figure 1-2 As shown, a double-sided light emitting LED array light source for a flexible circuit substrate includes a flexible planar transparent circuit substrate 1, a plurality of LED chips 2, a conductive pattern 3, and a fluorescent film 4, on one side of the flexible planar transparent circuit substrate 1. A conductive pattern 3 is provided, and a bonding area is reserved on the conductive pattern 3. The LED chip 2 is directly attached to the bonding area, and is connected to each other through the conductive pattern 3, and one or two fluorescent films are arranged on the LED array 4 Package the LED chip 2 as a whole. The light emitted by the PN junction of the LED chip 2 is converted into visible light by the fluorescent film 4 and emitted to both sides.

[0030] The flexible flat transparent circuit substrate 1 has a temperature resistance of 250 degrees Celsius or more, a thickness of 1 mm or less, and a tensile strength of 1 MPa or more, so that no fracture, microcracks, and no wrinkles occur after bending to a minimum of 2 mm.

[0031] Such as image 3 As shown, the LED chip 2 adopts the stripped sapphire circuit substrate and only retains the original PN junction chip. Such as Figure 4 As shown, the LED chip 2 adopts a flip-chip LED chip.

[0032] The flexible flat transparent circuit board 1 has certain characteristics such as solder resistance, lightness and thinness, and mechanical strength. The flexible flat transparent circuit substrate 1 uses one of a transparent polyester film, a polyimide film, and PMMA. In addition, the material of the flexible flat transparent circuit substrate 1 may also be doped with fluorescent powders such as Ce3+ aluminate, Eu nitride), which has the function of converting LED light radiation into visible light. The thickness of the flexible flat transparent circuit substrate 1 is between 0.08 mm and 0.2 mm.

[0033] At the same time, the flexible planar transparent circuit substrate 1 can also be made of conductive materials with conductive patterns, such as one of thin film materials such as copper foil, aluminum foil, and silver foil.

[0034] The flexible planar transparent circuit substrate 1 is attached with a corresponding metalized conductive circuit on one side. The coating method of the metalized circuit includes one or a combination of sputtering, electroless plating, and MOCVD (the coating method is attached with a patent). After that, solder resist is printed on the fluorescent circuit board.

[0035] During the design, a plurality of LED chips 1 are integrated and packaged between the fluorescent film and the flexible circuit substrate, and the upper and lower sides of the LED chip 1 simultaneously excite the fluorescent film to emit light during operation.

[0036] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the industry should understand that the present invention is not limited by the foregoing embodiments. The foregoing embodiments and descriptions only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have Various changes and improvements, these changes and improvements all fall within the scope of the claimed invention. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

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PUM

Property	Measurement	Unit
Heat resistant	>= 250.0	°C
Thickness	<= 1.0	mm
Tensile strength	>= 1.0	MPa
tensile		MPa
Particle size		Pa
strength	10

Description & Claims & Application Information

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Classification and recommendation of technical efficacy words

Improve conversion efficiency
Efficient production

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High degree of automation Improve reliability Good consistency Improve light extraction efficiency Good cooling Good heat dissipation Heat spreader Surface mounting Light emission Flexible circuits

Flexible circuit substrate double-sided light-emitting LED array light source

AI-Extracted Technical Summary

Problems solved by technology

Method used

Abstract

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Examples

Example Embodiment

PUM

Description & Claims & Application Information

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