Flexible circuit substrate double-sided light-emitting LED array light source

Abstract

The invention discloses a flexible circuit substrate double-sided light-emitting LED array light source. The flexible circuit substrate double-sided light-emitting LED array light source comprises a plurality of LED chips. The flexible circuit substrate double-sided light-emitting LED array light source is characterized in that the flexible circuit substrate double-sided light-emitting LED array light source further comprises a flexible flat transparent circuit substrate, a conductive pattern and a fluorescent film; one side of the flexible flat transparent circuit substrate is provided with the conductive pattern; binding regions are reserved on the conductive pattern; the LED chips are directly arranged on the binding regions in a surface-mount manner and are communicated with one another through the conductive pattern; and the fluorescent film is arranged on the LED array such that the LED chips can be entirely encapsulated. With the flexible circuit substrate double-sided light-emitting LED array light source of the invention adopted, problems of low light-emitting efficiency and low light source utilization rate, which are caused by single-sided light emission of an LED light source in the prior art, can be solved; and the LED chips can be protected, and at the same time, PN junctions of the LED chips can be fully utilized to emit light; and advantages of a plane array source light can be utilized, and therefore, heat dissipation capacity can be improved, and cost and weight of a heat sink and a radiator can be omitted. Thus, the flexible circuit substrate double-sided light-emitting LED array light source is advantageous in improved light-emitting efficiency and improved utilization rate.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, in particular to an LED array light source emitting light from both sides of a flexible circuit substrate. Background technique [0002] With the continuous development of LED in the field of lighting, people have higher and higher requirements for its light extraction efficiency. The packaging materials, structures, and methods of LEDs are all factors that affect the light extraction efficiency. [0003] At present, there are several ways to improve the light output efficiency of LEDs: transparent circuit substrate technology, metal film reflection technology, and flip chip technology. The usual blue and green light wafers grow GaN-based LED structure layers on the sapphire circuit substrate by MOCVD technology, and the light emitted by the P / N junction light-emitting area is emitted through the upper P-type area. And due to the poor conductivity of P-type GaN, in order to obtain good cur...

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Problems solved by technology

[0005] In order to solve the problems in the prior art that the LED light source emits light from one side, the light output efficiency is poor, and the utilization rate of the light source is low, the present invention provides a method that fully utilizes the PN junction of the LED chip t

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