Method for preparing immersion gold printed circuit board

A technology for printed circuit boards and manufacturing methods, applied in the direction of electrical connection formation of printed components, etc., can solve the problems of low ink concentration, poor viscosity, low cost performance, etc., and achieve the goal of reducing operation steps, saving production costs, and reducing production materials Effect

Inactive Publication Date: 2014-04-30
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] First of all, the traditional method needs to make an additional set of plugging tools for the "aluminum skin plugging" process, which requires one or two more plugging-exposure-development-baking processes, and requires repeated education and training for operators to master it. Production method, although the half plug hole made by the traditional method meets the half plug hole production standard, but the process is complicated, the efficiency is low, and the cost performance is low
Secondly, it is often difficult to control the amount of ink inserted into the half plug hole made by the traditional method. Sometimes because the printing pressure is too high, or the ink concentration is low and the viscosity is not good, the drilled hole is completely filled with ink, making the half plug hole made low quality

Method used

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Examples

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Embodiment 1

[0021] Embodiment 1, a method for manufacturing an immersion gold printed circuit board, comprising the following steps:

[0022] Step S101, provide the PCB board with the outer layer circuit pattern and prepare the plug hole, and prepare the aluminum sheet with the guide hole, wherein the aluminum sheet is used to pass the ink through the holes corresponding to the drilling positions on the PCB board. The pilot hole of the aluminum sheet is plugged into the drilled hole of the PCB board.

[0023] The ink is introduced into the drilled holes on the PCB through the pilot holes on the aluminum sheet. In one of the embodiments, the aluminum sheet is placed on the PCB board before the PCB board is drilled, and the aluminum sheet is also drilled when the PCB board is drilled. The hole positions correspond to each other.

[0024] Step S102 , inserting ink into the drilled holes of the PCB board through the aluminum sheet, and performing solder resist treatment on the PCB board aft...

Embodiment 2

[0033] Embodiment 2, a method for manufacturing an immersion gold printed circuit board, comprising the following steps:

[0034] Step S201, material cutting. Prepare the materials needed to make PCB boards, such as core boards, prepregs, film negatives, reagents, production equipment, etc.

[0035] Step S202, making an inner circuit pattern. Make the circuit pattern on the inner layer board of the prefabricated PCB board by pasting dry film, making film negative, exposing, developing, etching, etc.

[0036] Step S203, laminating the core board.

[0037] Step S204, drilling holes on the PCB obtained in step S203. In one of the embodiments, the aluminum sheet is placed on the PCB board before the PCB board is drilled, and the aluminum sheet is also drilled when the PCB board is drilled. The hole positions correspond to each other. This can save time, improve efficiency, kill two birds with one stone, and avoid drilling aluminum sheets alone. Wherein, the aluminum sheet is...

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PUM

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Abstract

The invention discloses a method for preparing an immersion gold printed circuit board. The method includes the steps that an outer layer circuit diagram is provided and manufactured, and a PCB with plug holes and an aluminum sheet with guide holes are prepared, wherein the aluminum sheet is used for plugging printing ink into drill holes of the PCB through the aluminum sheet guide holes corresponding to the drill holes in the PCB; the printing ink is plugged into the drill holes of the PCB through the aluminum sheet; solder resisting is conducted on the PCB with the drill holes into which printing ink is plugged; exposure is conducted on the PCB, wherein in the exposure process, Favrini negative films are utilized to block light for the faces of the drill holes in which semi-plug holes need to be formed; the PCB on which exposure is conducted is developed, wherein in the developing process, printing ink of 20% to 80% of the depth of the drill holes is rinsed out through developing potions; immersion gold processing is conducted on the developed PCB. The method for preparing the semi-plug holes of the immersion gold board is easy to control, operation steps and production materials are reduced, production cost is greatly saved, and production efficiency can be rapidly improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to an immersion gold printed circuit board manufacturing method. Background technique [0002] With the continuous development of electronic products in the direction of multi-functionality, miniaturization, light weight and high performance, the requirements for miniaturization and high density of printed circuit boards are also increasing, and its products are also changing from traditional printed circuit boards to high-density Build-up printed board development. The key to the production of high-density laminated printed boards is the realization of its ultra-high density and high reliability. The customer's proposal to make half-plug holes on the printed circuit board is a new process in the development of PCB board technology. [0003] The half-plugged hole process requires plugged holes, but it cannot be completely filled. The back of the plugged hole is solde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
Inventor 刘攀王笑辉曾志军
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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