Gold-plating gold and silver palladium alloy single-crystal bonding filament and manufacturing method thereof

A manufacturing method, palladium alloy technology, applied in the field of microelectronics, can solve the problems of wire breakage, poor high temperature stability, easy oxidation of aluminum wire surface, etc., and achieve the effect of stable and reliable performance and low price

Inactive Publication Date: 2014-05-07
江西蓝微电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a gold-plated gold-silver-palladium alloy single crystal bonding wire with high-purity silver as the main material and its manufacturing method, which overcomes the problems of easy oxidation,

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A gold-plated gold-silver-palladium alloy single crystal bonding wire with high-purity silver as the main material, the material forming the bonding wire is composed of the following raw materials in weight percentage: gold (Au) accounts for 1.8%, palladium (Pd) accounts for 0.04%, Europium (Eu) accounts for 0.002%, lanthanum (La) accounts for 0.001%, and silver (Ag) accounts for 98.157%; the purity of gold is required to be greater than 99.99%, the purity of silver is greater than 99.9999%, the purity of palladium is greater than 99.999%, and the purity of europium is greater than 99.9%, the purity of lanthanum is greater than 99.5%.

[0021] Its manufacturing process steps and method are as follows:

[0022] ① Extraction of high-purity silver: Using national standard GB / T4135 No. 1 silver (IC-Ag99.99) as the base material, high-purity silver with a purity greater than 99.9999% is extracted, washed and dried for later use.

[0023] ② Preparation of silver alloy ingots...

Embodiment 2

[0032] The present invention is realized in this way, a kind of gold-plated gold-silver-palladium alloy single-crystal bonding wire with high-purity silver as the main material, the material that forms this bonding wire is made up of the raw material of following percentage by weight: gold (Au) accounts for 2.2%, palladium (Pd) accounts for 0.08%, europium (Eu) accounts for 0.004%, lanthanum (La) accounts for 0.003%, silver (Ag) accounts for 97.713%; the purity of gold is required to be greater than 99.99%, the purity of silver is greater than 99.9999%, and the purity of palladium is greater than 99.999%, the purity of europium is greater than 99.9%, and the purity of lanthanum is greater than 99.5%.

[0033] Its manufacturing process steps and method are as follows:

[0034] ① Extraction of high-purity silver: Using national standard GB / T4135 No. 1 silver (IC-Ag99.99) as the base material, high-purity silver with a purity greater than 99.9999% is extracted, washed and dried f...

Embodiment 3

[0044] The present invention is realized in this way, a kind of gold-plated gold-silver-palladium alloy single-crystal bonding wire with high-purity silver as the main material, the material that forms this bonding wire is made up of the raw material of following percentage by weight: gold (Au) accounts for 2.0%, palladium (Pd) accounts for 0.06%, europium (Eu) accounts for 0.003%, lanthanum (La) accounts for 0.002%, and silver (Ag) accounts for 97.935%. The purity of gold is required to be greater than 99.99%, the purity of silver to be greater than 99.9999%, the purity of palladium to be greater than 99.999%, the purity of europium to be greater than 99.9%, and the purity of lanthanum to be greater than 99.5%.

[0045] Its manufacturing process steps and method are as follows:

[0046] ① Extraction of high-purity silver: Using national standard GB / T4135 No. 1 silver (IC-Ag99.99) as the base material, high-purity silver with a purity greater than 99.9999% is extracted, washed...

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Abstract

The invention provides a gold-plating gold and silver palladium alloy single-crystal bonding filament and a manufacturing method thereof. The bonding filament is mainly made of high-purity silver and comprises metal, palladium, europium, lanthanum and other trace metal materials. The bonding filament comprises, by weight, 97.713%-98.157% of silver, 1.8%-2.2% of gold, 0.04%-0.08% of palladium, 0.002%-0.004% of europium and 0.001%-0.003% of lanthanum. The manufacturing method of the gold-plating gold and silver palladium alloy single-crystal bonding filament comprises the steps that high-purity silver with the purity larger than 99.9999% is extracted, a silver alloy ingot is manufactured, a cast-condition gold and silver palladium alloy single-crystal bus is manufactured, the single-crystal bus is pulled to be a single-crystal filament which is about 1mm long, after thermal processing, a pure-gold protection layer is electroplated on the surface of the single-crystal filament, and gold-plating gold and silver palladium alloy single-crystal bonding filament of different specifications are manufactured after precise pulling, thermal processing and washing.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and relates to a metal bonding wire used in the subsequent packaging process of microelectronics and a manufacturing method thereof, in particular to a gold-plated gold-silver-palladium alloy single crystal bonding wire made of alloy materials such as gold-plated gold-silver-palladium and the like and its Manufacturing method. Background technique [0002] At present, the most widely used wire packaging bonding wire used in the fields of integrated circuits and semiconductor discrete devices is gold bonding wire. Because yellow metal is a precious metal, the price is expensive and rising day by day, which brings heavy cost pressure to the users of low-end LED and IC packaging with the largest consumption. Therefore, the industry urgently needs new bonding wire materials with relatively low cost and stable and reliable performance to replace gold bonding wires. The gold-plated gold-silv...

Claims

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Application Information

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IPC IPC(8): H01L23/49H01L21/48C22C5/06C22F1/14
CPCH01L24/43H01L2224/45139H01L2224/45565H01L2224/45644H01L2224/43H01L2224/43848H01L2224/45015H01L2224/45144H01L2924/00011H01L2224/45H01L2224/431H01L2224/43125H01L2924/01201H01L2924/01079H01L2924/01046H01L2924/01063H01L2924/01057H01L2924/00014H01L2924/20751H01L2924/20752H01L2924/20753H01L2924/20754H01L2924/20755H01L2924/013H01L2924/01206H01L2924/01049H01L2924/00012
Inventor 徐云管李湘平彭庶瑶梁建华
Owner 江西蓝微电子科技有限公司
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