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Flexible glue-free copper-clad plate and manufacturing method thereof

A copper-clad laminate and flexible technology, which is applied in the field of flexible non-adhesive copper-clad laminate and its preparation, can solve the problems of consistent expansion coefficient of copper foil, poor heat resistance, high bonding strength, etc., achieve satisfactory bonding strength and achieve dimensional stability sexual effect

Active Publication Date: 2014-05-21
CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The three-layer adhesive type flexible copper clad laminate is composed of copper foil, adhesive and polyimide film. Due to the adhesive, its heat resistance is poor
The current polyimide cannot simultaneously solve the two problems of consistent expansion coefficient with copper foil and high bonding strength

Method used

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  • Flexible glue-free copper-clad plate and manufacturing method thereof
  • Flexible glue-free copper-clad plate and manufacturing method thereof
  • Flexible glue-free copper-clad plate and manufacturing method thereof

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preparation example Construction

[0023] The embodiment of the present invention discloses a method for preparing a flexible adhesive-free copper-clad laminate, which includes the following steps:

[0024] (A) The aromatic dianhydride with the structure of formula (I), the nitrogen-containing aromatic heterocyclic diamine with the structure of formula (II) and the aromatic diamine with the structure of formula (III) are polymerized in an organic solvent to obtain polyamide acid solution;

[0025]

[0026] Among them, R 1 for

[0027] R 2 for

[0028] R 3 for

[0029] (B) Coating the polyamic acid solution on a copper foil, removing the organic solvent and performing thermal imidization to obtain a flexible adhesive-free copper clad laminate.

[0030] In the present invention, aromatic dianhydrides and diamines with specific structures are selected, and polyimide resins are obtained through polymerization and imidization. The present invention selects aromatic dianhydrides with the structu...

Embodiment 1

[0038] 2,5-bis(4-aminophenyl)pyridine (1.568g, 0.006mol) and 4,4'-diaminodiphenyl ether (0.801g, 0.004mol) were added to N-methylpyrrolidone (20g) , stirred at room temperature to dissolve the solid. Add 4,4′-biphenyldianhydride (2.942 g, 0.010 mol) and stir at room temperature for 24 hours to form a polyamic acid solution.

[0039] After the polyamic acid solution was salivated and coated on the surface of the copper foil, it was dried in a vacuum oven at 110° C. for 240 minutes. Then, it was slowly heated to 300° C. in a nitrogen-protected oven and kept for 60 minutes. That is, a flexible non-adhesive copper clad laminate is obtained.

Embodiment 2

[0041]2,5-bis(4-aminophenyl)pyrimidine (1.574g, 0.006mol) and 4,4'-diaminodiphenyl ether (0.801g, 0.004mol) were added to N-methylpyrrolidone (20g) , stirred at room temperature to dissolve the solid. Add 4,4′-biphenyldianhydride (2.942 g, 0.010 mol) and stir at room temperature for 24 hours to form a polyamic acid solution.

[0042] After the polyamic acid solution was salivated and coated on the surface of the copper foil, it was dried in a vacuum oven at 110° C. for 240 minutes. Then, it was slowly heated to 300° C. in a nitrogen-protected oven and kept for 60 minutes. That is, a flexible non-adhesive copper clad laminate is obtained.

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Abstract

The invention provides polyimide resin. The polyimide resin is prepared according to the following method that a polymerization reaction is performed on aromatic dianhydride of the structure as a structural formula (I), nitrogenous heteroaromatic diamine of the structure as a structural formula (II) and aromatic diamine of the structure as a structural formula (III) in an organic solution to obtain a polyamide acid solution; copper foil is coated with the polyamide acid solution, and hot imidization is performed after the organic solution is removed to obtain a flexible glue-free copper-clad plate. The polyimide resin is matched with the copper foil in thermal expansion coefficient, and size stability of the copper-clad plate in the application process is achieved. Moreover, bonding strength between the polyimide resin and the copper foil is good.

Description

technical field [0001] The invention relates to the field of polymer resins, in particular to a flexible non-adhesive copper-clad laminate and a preparation method thereof. Background technique [0002] Polyimide is a class of materials with high strength, high modulus, high heat resistance and high dielectric properties, and has been widely used in aerospace, membrane separation, and microelectronics manufacturing fields. In the field of microelectronics, polyimide is often used as an insulating base film for flexible printed circuits. [0003] Flexible printed circuits are usually divided into two types of flexible copper clad laminates: three-layer adhesive type and double-layer non-adhesive type. The three-layer adhesive type flexible copper clad laminate is composed of copper foil, adhesive and polyimide film. Due to the adhesive, its heat resistance is poor. When the temperature is higher than 150°C, as the adhesive deteriorates, the peel strength of the three-layer ...

Claims

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Application Information

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IPC IPC(8): B05D7/24B05D3/00C08G73/10B32B15/08
Inventor 郭海泉姚海波杜志军康传清金日哲丁金英邱雪鹏高连勋
Owner CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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