Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

IGBT power device for low power application and method of manufacturing the same

A technology of power device and manufacturing method, which is applied in the direction of semiconductor/solid-state device manufacturing, semiconductor device, electrical components, etc., to achieve the effect of improving turn-off time, turn-on and turn-off time

Active Publication Date: 2017-01-25
成都方舟微电子有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In low-power applications, the advantages of power MOSFETs are more obvious. Its fast channel current turn-on and turn-off characteristics make it a better match for low-voltage high-frequency circuits, but if the IGBT can also have the above-mentioned fast turn-on and turn-off characteristics of MOSFETs If so, it will trigger a revolution in semiconductor devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • IGBT power device for low power application and method of manufacturing the same
  • IGBT power device for low power application and method of manufacturing the same
  • IGBT power device for low power application and method of manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] In order to facilitate those skilled in the art to further understand the present invention, clearly understand the technical solutions of the present invention, and fully and fully disclose the relevant technical content of the present invention, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Of course The described specific embodiments only list a part of the embodiments of the present invention, rather than all the embodiments, to help understand the present invention and its core ideas.

[0022] The basic idea of ​​the present invention is to optimize the design of the backside structure of the IGBT, to increase the metal-filled trench without affecting the voltage resistance of the device itself, to heavily dope the P-type, and to only use the trench surface (especially the trench The bottom of the groove) is injected into the N-type region, the N-type region can also be arranged in a rep...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an IGBT (Insulated Gate Bipolar Translator) power device applied at low power and a manufacturing method thereof. The method comprises the following steps: performing semiconductor impurity injection or diffusion operation on the front side of a silicon substrate; performing corroding treatment on the front side which is subjected to the semiconductor impurity injection or diffusion operation; performing P type ion injection on the back side of the silicon substrate to form a P region; forming a groove on the back side of the silicon substrate; performing N type ion injection on the surface of the groove to form an N region; performing diffusion operation on the P region and the N region; performing an outer layer encapsulating treatment on the silicon substrate. The method has the advantages that by means of groove formation, P type ion injection and N type ion injection on the surface of the groove under the condition of not influencing the voltage endurance capability of the device, the switch-on / off time of a low-voltage IGBT can be prolonged respectively, extremely low startup voltage drop and rapid reverse switch-off recovery are realized.

Description

Technical field [0001] The invention belongs to the technical field of semiconductor power electronic device manufacturing, and in particular, relates to a method for manufacturing an IGBT power device for low-power applications. Background technique [0002] IGBT (Insulated Gate Bipolar Transistor) is a composite device of a bipolar transistor and a power MOSFET. Its structure can be equivalent to a combination of one MOS and two bipolar transistors. In normal operation, Bottom P + Connected to positive potential, called the anode of IGBT, surface N - The contact layer is usually connected to a negative or zero potential, which is called the cathode of the IGBT, and the electrode drawn through the gate dielectric is the gate of the IGBT. Because of its characteristics are significantly better than bipolar transistors and power MOSFETs, IGBTs have been widely used in motor control, industrial speed regulation, household appliances, lighting, network communications, computers, aut...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/331H01L29/739H01L29/06
CPCH01L29/66333H01L29/7393
Inventor 方伟周仲建
Owner 成都方舟微电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products