led transverse fluid cooling cob light source and its encapsulation process

Abstract

The invention relates to an LED (Light Emitting Diode) horizontal fluid dissipating COB (Chip-On-Board) light source and a packaging process thereof. The COB light source comprises a microarray heat pipe flat plate, a copper plating layer, a silver plating layer, a line layer, an insulation paint layer, a chip and silica gel, wherein the microarray heat pipe flat plate, the copper plating layer, the silver plating layer, the line layer and the insulation paint layer are sequentially compounded; the external surface of the chip is fixed by the silica gel in a sealing manner; the chip is tightly adhered to the silver plating layer and is fixed by welding; the appearance of the microarray heat pipe flat plate is laminated; the microarray heat pipe flat plate is subjected to cold-drawn by using an aluminum product to be integrally formed; a plurality of microarray channels which are operated independently are distributed in parallel inside the microarray heat pipe flat plate; the microarray channels are filled with a working medium; two ends of each microarray channel filled with the working medium are sealed. After the surface of the microarray heat pipe flat plate absorbs heat, the working medium in the microarray channels evaporates, heat is quickly transferred to a condensation section and then is released, and then the working medium returns to an evaporation section to continuously absorb heat, thus a series of continuous phase transition heat and mass transfer processes are repeated.

Description

technical field [0001] The invention relates to an LED lateral fluid cooling COB light source and a packaging process thereof, belonging to the technical field of LED lighting packaging. Background technique [0002] LED horizontal fluid cooling COB light source is sought after by many packaging companies for its high-efficiency performance and low-cost manufacturing. However, its reliability issues such as light efficiency and life cannot be guaranteed. COB packaging can divide one or two large chips into ten parts. A few small chips can be made relatively small, so the heat dissipation efficiency is required to be relatively high. From the perspective of the vertical plane, the COB package can achieve better efficiency in a limited volume, so it requires both horizontal and vertical heat dissipation. Have better performance. At present, most integrated COB packaged light sources use aluminum substrates as materials. Aluminum substrate COBs have high thermal resistance, lo...

AI Technical Summary

Problems solved by technology

[0002] LED horizontal fluid cooling COB light source is sought after by many packaging companies for its high-efficiency performance and low-cost manufacturing. However, its reliability issues such as light efficiency and life cannot be guaranteed. COB packaging can divide one or two large chips into ten parts. Several small chips can be made relatively small, so the heat dissipation efficiency is required to be relatively high. From the perspective of the vertical plane, the COB package can achieve better efficiency in a limited volume, so it requires both horizontal and vertical heat dissipation. have better performance

At present, most integrated COB packaged light sources use aluminum substrates as materials. Aluminum substrate COBs have high thermal resistance, low reliability, and are prone to light decay and dead lights. On the other hand, the heat dissipation of COB packages still needs to be improved. COB light sources Accumulated heating concentration is high, if the heat of the light source cannot be exported in time, the life of the light source will be shortened, and the traditional gold wire is not needed, saving costs

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