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Thick copper printed circuit board and manufacturing method thereof

A technology for printed circuit boards and manufacturing methods, which is applied to printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as low probability of success, poor etching uniformity, and corrosion resistance failure defects, and achieve process saving, simple process, and The effect of high yield

Inactive Publication Date: 2014-05-28
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The production of this method combines solder resist and two times of etching. Firstly, it is difficult to control the amount of etching by acidic etching, and the etching uniformity is poor; secondly, when the ink covers the bottom of the circuit, it is easy to remain on the sidewall, thereby hindering the adhesion of the sidewall resist layer and causing blisters. After the solder mask is removed, the corrosion resistance failure is prone to conductor defects, the overall production is difficult, and the probability of success is low

Method used

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  • Thick copper printed circuit board and manufacturing method thereof
  • Thick copper printed circuit board and manufacturing method thereof
  • Thick copper printed circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A kind of copper thickness of this embodiment is the manufacture method of the thick copper printed wiring board of 6oz, comprises the following steps:

[0040] Cutting→inner layer dry film→inner layer etching→lamination→ceramic grinding plate→immersion copper plate plating→inner layer dry film→graphic plating→outer layer etching→browning→lamination→post process flow.

[0041] (1) On the core board (copper thickness is 4oz), the circuit pattern is obtained through dry film and etching operations (such as figure 1 shown);

[0042] (2) The surface of the circuit board obtained in step (1) is covered with prepreg and copper foil in turn, and then laminated (such as figure 2 shown);

[0043] The operating parameters of lamination are: under vacuum state, the pressure of lamination is controlled at 355psi, the circuit board is raised from room temperature to 185°C, the heating rate is controlled at 1.8°C / min in the range of 80°C-140°C, and the high temperature is 185°C M...

Embodiment 2

[0053] A kind of copper thickness of this embodiment is the manufacture method of the thick copper printed circuit board of 5 oz, comprises the following steps:

[0054] Cutting→inner layer dry film→inner layer etching→lamination→ceramic grinding plate→immersion copper plate plating→inner layer dry film→graphic plating→outer layer etching→browning→lamination→post process flow.

[0055] (1) On the core board (copper thickness is 3oz), the circuit pattern is obtained through dry film and etching operations (such as figure 1 shown);

[0056] (2) The surface of the circuit board obtained in step (1) is covered with prepreg and copper foil in turn, and then laminated (such as figure 2 shown);

[0057] The operating parameters of lamination are: under vacuum, the pressure of lamination is controlled at 345psi, the circuit board is raised from room temperature to 184°C, the heating rate is controlled at 2.0°C / min in the range of 80°C-140°C, and the high temperature is 184°C Maint...

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Abstract

The invention discloses a thick copper printed circuit board and a manufacturing method thereof. The manufacturing method of the thick copper printed circuit board comprises the following steps of board cutting, inner layer film drying, inner layer etching, laminating, ceramic board grinding, heavy copper plate plating, inner layer film drying, pattern plating, outer layer etching, laminating and after process flow. The thick copper printed circuit board and the manufacturing method thereof overcome the defects that the circuit distance of the designed thick copper printed circuit board is insufficient and one-time etching can not be achieved, the modes of filling of pressed flow glue and peeling and board grinding are used for manufacturing, circuit filling is flat and even, and the manufacturing success rate is high. The manufacturing method of the thick copper printed circuit board can be used for manufacturing circuit boards of any copper thicknesses theoretically, the process is simple, and the rate of finished products is high.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a thick copper printed circuit board and a manufacturing method thereof. Background technique [0002] For some inner layer thick copper printed circuit boards, when the distance required by the customer is not enough for one-time etching, the industry usually has the following methods to solve it. to the required thickness, and finally remove the solder mask; the second is to fill the circuit gap with resin and then add copper plating to the required thickness. The biggest problem with these two methods is that it is difficult to apply oil (resin) during screen printing, especially the resin, which has a higher viscosity, which is prone to problems such as uneven thickness of the resin on the copper skin and insufficient filling of the line gap, and the resin is cured. The stress caused the core board to warp and damage, and the probability of successful producti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/00
Inventor 王雪涛乔书晓
Owner GUANGZHOU FASTPRINT CIRCUIT TECH