Epoxy resin compound and radiant heat circuit board using the same

A technology of epoxy resin and epoxy adduct, which can be applied to circuits, printed circuits, printed circuits, etc., can solve the problems of reducing the reliability of heating devices, failing to work normally, and increasing the temperature of circuit boards, and achieves improvement. Improved solubility, precipitation, and improved thermal conductivity

Active Publication Date: 2014-06-04
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat emitted by the heating device increases the temperature of the circuit board, causing the heating and light device to fail to work normally and reducing the reliability of the heating device

Method used

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  • Epoxy resin compound and radiant heat circuit board using the same
  • Epoxy resin compound and radiant heat circuit board using the same
  • Epoxy resin compound and radiant heat circuit board using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0073] Hereinafter, the present disclosure will be described in more detail through embodiments.

[0074] The thermal conductivity was measured by an abnormal heat conduction scheme using a thermal conductivity meter LFA447 manufactured by NETZSCH.

[0075] The epoxy resin composition is coated on the Al substrate and cured, and then the Al substrate is bent at 180 degrees and returned to the original position, and the peeling performance of Al is represented by the delamination degree (delmaination degree) of the epoxy resin composition . Record when the degree of delamination is less than 0.2 cm. Record when the degree of delamination is in the range of 0.2 cm to 1 cm. Record when the degree of delamination is 1 cm or greater.

Embodiment approach 1

[0077] 3w% bisphenol F, 3w% o-cresol-novolak, 2w% 4,4'oxobis(N-(4-(epoxy-2-ylmethoxy) Benzylidene)aniline (4,4'oxybis(N-(4-(oxiran-2-ylmethoxy)benzylidene)-aniline)), 2w% NC-3000H epoxy resin (Nippon Kayaku co.,Ltd), 2w% of DAS curing agent, 2w% of DAS curing accelerator, 0.5w% of BYK-W980 and 2.5w% of the epoxy adduct represented in Chemical Formula 2 were mixed with each other and stirred at a temperature of 40°C for 10 minutes Thereafter, 85w% of alumina inorganic filler was introduced into the mixture, and stirred at room temperature for 20 minutes to 30 minutes to prepare the crystalline epoxy resin composition of Embodiment 1.

Embodiment approach 2

[0079] 3w% of bisphenol F, 2w% of 4,4'oxobis(N-(4-(epoxy-2-ylmethoxy)benzylidene)aniline, 1.5w% of NC-3000H ring Oxygen resin (Nippon Kayaku co., Ltd), 1w% of DAS curing agent, 1.5w% of the epoxy adduct represented in Chemical Formula 2 and 0.5w% of BYK-W980 were mixed with each other and heated at a temperature of 40°C Stir for 10 minutes. Thereafter, introduce 88w% alumina inorganic filler into the mixture, and stir at room temperature for 20 to 30 minutes to prepare the crystalline epoxy resin composition of Embodiment 2.

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PUM

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Abstract

Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.

Description

technical field [0001] The present disclosure relates to an epoxy resin composition. More specifically, the present disclosure relates to an epoxy resin composition for use as an insulating layer of a radiant heating circuit board. Background technique [0002] The circuit board includes circuit patterns mounted on an electrically insulating substrate and is used to mount electronic components thereon. [0003] These electronic components may include heat generating devices, such as light emitting diodes (LEDs), which emit large amounts of heat. The heat emitted by the heating device increases the temperature of the circuit board, causing the heating and light device to fail to work normally and reducing the reliability of the heating device. [0004] Therefore, in the circuit board, the heat radiation structure is very important for heat dissipation from the electronic components to the outside, and the thermal conductivity of the insulating layer formed in the circuit bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/00C08G59/18H05K7/20
CPCH05K2201/0209H01L23/3737H01L2924/0002C08G59/184H05K1/056H01L23/142C08L63/00C08K2003/2227C08K3/22H01L2924/00C08K3/00C08G59/18H05K7/20H05K1/0201H05K1/0373
Inventor 文诚培朴宰万尹钟钦金海燕赵寅熙
Owner LG INNOTEK CO LTD
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