Production process of large-diameter ultrathin quartz wafer

Abstract

The invention belongs to the technical field of a quartz wafer tool, and particularly relates to a production process of a large-diameter ultrathin quartz wafer. The invention discloses a production process of a large-diameter ultrathin quartz wafer. The production process comprises the following steps of A, cutting quartz crystal lump by utilizing a fret saw; B, grinding the quartz crystal lump by adding green carbon silicon sand by utilizing a double-sided grinding machine; C, coating one surface of a wafer with protective paint by utilizing a spin coater; D, adhering the wafer onto an optical cement plate; E, grinding the optical cement plate with wafers being adhered on the upper surface and the lower surface; F, polishing the wafer with two sides being well ground by utilizing a double-sided polishing machine; G, placing the wafer into a wafer box after the wafer is qualified in inspection. By adopting the production process, the precision of a product of the processed quartz wafer is guaranteed, the mass production of the large-diameter ultrathin wafer is realized, the production efficiency is improved, and the production of the large-diameter quartz wafer is realized.

Description

technical field [0001] The invention belongs to the technical field of quartz wafer appliances, in particular to a production process of a large-diameter ultra-thin quartz wafer. Background technique [0002] With the development of laser technology, especially the rapid development of MEMS technology, not only requires a very thin thickness of optical components, but also has stricter requirements on the TTV BOW thickness tolerance and thickness of the wafer, and the thinner the optical component, the material defects and the use environment The smaller the impact on the performance of optical components, but the higher the technical difficulty for processors. [0003] The existing processing technology can only use a double-sided polishing machine to polish wafers with a diameter of 150-300 mm and a thickness of more than 0.5 mm, and the larger the diameter, the thicker the processing thickness of the wafer, and it is difficult to process quartz wafers with a thickness of ...

AI Technical Summary

Problems solved by technology

[0002] With the development of laser technology, especially the rapid development of MEMS technology, not only requires a very thin thickness of optical components, but also has stricter requirements on the TTV BOW thickness tolerance and thickness of the wafer, and the thinner the optical component, the material defects and the use environment The smaller the impact on the performance of optical components, but the higher the technical difficulty for processors

[0003] The existing processing technology can only use a double-sided polishing machine to polish wafers with a diameter of 150-300 mm and a thickness of more than 0.5 mm, and the larger the diameter, the thicker the processing thickness of the wafer, and it is difficult to process quartz wafers with a thickness of 0.1 mm in batches

In actual production, quartz wafers with a diameter of 150m and a thickness of 0.1mm have not formed mass production conditions, and the equipment occupancy rate is high and the production efficiency is low.