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Metallization method and application of ito conductive layer on flexible pet substrate

A conductive layer and metallization technology, applied in the field of chemical plating, can solve the problems of large differences in surface key groups and inability to apply conductive PET plastic conductive surface metallization, etc., to achieve clear traces, wide fluctuation range of process parameters, no overlap The effect of line bridging

Active Publication Date: 2016-01-27
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the different properties of the glass substrate and the PET plastic substrate, the key groups on the surface are greatly different, this method cannot be applied to the metallization of the conductive surface of the conductive PET plastic, and a metal coating with clear traces cannot be obtained on the conductive surface of the conductive PET plastic.

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  • Metallization method and application of ito conductive layer on flexible pet substrate
  • Metallization method and application of ito conductive layer on flexible pet substrate
  • Metallization method and application of ito conductive layer on flexible pet substrate

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Embodiment Construction

[0041] Implementation example of the present invention The specific implementation steps are: solvent degreasingwater washing—alkaline degreasing—water washingalkaline etchingwater washingacid activation—water washing—precatalysis—water washing—catalysis—water washing—reduction—water washing—electroless nickel plating .

[0042] All formulas in the implementation examples of the present invention are configured according to mass percentage.

[0043] Specific implementation examples one to eight refer to the attached Figure 3 to Figure 10 .

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Abstract

The invention discloses a method for metallizing an ITO conductive layer of a flexible PET substrate and an application thereof, belonging to the technical field of electroless plating, and is suitable for metallizing edge conductive traces and terminals of an ITO electrode layer of a flexible touch screen. The electroless nickel plating method of the present invention comprises the following eight steps: solvent degreasing, alkaline degreasing, alkaline etching, acid activation, pre-catalysis, catalysis, reduction, and chemical nickel plating. This method has excellent selectivity to the conductive surface of PET plastic, overcomes the shortcoming that traditional electroless nickel plating cannot selectively obtain metal coating on the conductive surface of PET plastic, and the obtained coating is firmly combined with the conductive substrate of PET plastic and has good gloss, which greatly reduces the The resistance of the PET plastic conductive surface improves its conductive performance. The electroless nickel plating method of the present invention has rich sources of raw materials, is economical and environmentally friendly, and is suitable for the metallization of the edge conductive traces and conductive terminals of the ITO electrode layer (conductive PET plastic) of the flexible touch screen and the metallization of other conductive PET plastic components. .

Description

technical field [0001] This item relates to a metallization method and application of a flexible PET substrate ITO conductive layer and belongs to the field of electroless plating technology. Background technique [0002] With the advancement of technology and the improvement of human living standards, portable mobile devices (mobile phones, computers, tablets, etc.) and wearable devices (smart watches, etc.) Bigger and bigger, more and more demanding. As the core components of the above-mentioned devices, ordinary hard touch screens can no longer meet the needs of consumers, and flexible touch screens are gradually entering everyone's field of vision. [0003] Currently, LG, Samsung, and Apple are launching their own flexible touch screens one after another. Compared with the traditional hard touch screen, the flexible touch screen has obvious advantages. It is not only lighter and thinner in size, but also lower in power consumption than the original device, which helps ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/20C23C18/36
Inventor 何建平郭虎夏伟朱泽涛范晓丽潘旭晨薛海荣
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS