Preparation method of gas sensor element based on quasi-oriented tungsten oxide nanowires
A technology of tungsten oxide nanowires and gas sensors, applied in the direction of material resistance, etc., to achieve the effects of novel structure, fast response characteristics, and enhanced electrical stability
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Embodiment 1
[0030] (1) Clean the substrate
[0031] The sensor base material is thoroughly ultrasonically cleaned before use to remove surface impurities. Ultrasonic cleaning the alumina ceramic substrate in absolute ethanol for 20 minutes; take out the substrate, rinse with deionized water, and then continue ultrasonic cleaning in hydrofluoric acid solution for 5 minutes to thoroughly clean the surface impurities; then, use deionized The water was continued to be ultrasonically cleaned for 20 minutes; finally, the substrate was dried in an air atmosphere for future use.
[0032] (2) Sputtering interdigitated electrodes
[0033] The alumina sensor ceramic substrate after step (1) ultrasonic cleaning and thorough drying is placed in the vacuum chamber of the ultra-high vacuum target magnetron sputtering equipment, and the high-purity metal platinum with a mass purity of 99.999% is used as the target material. Using argon gas with a mass purity of 99.999% as the working gas, the sputterin...
Embodiment 2
[0043] Steps (1) to (4) of this embodiment are the same as in Embodiment 1, only the annealing temperature in step (5) is changed to 450° C., and other conditions remain unchanged. The nanowires obtained after annealing become sparse, some nanowires are bent, the diameter of the nanowires becomes larger, and irregular nanoparticles appear on the surface of the substrate. That is, during the annealing process of the nanowires, a few nanowires on the substrate are fused to become irregular nanoparticles, the nanowires become sparse, and the unfused nanowires are bent during the air annealing process.
Embodiment 3
[0045] Steps (1) to (4) of this embodiment are the same as in Embodiment 1, only the annealing temperature in step (5) is changed to 500° C., and other conditions remain unchanged. The annealed product nanowires become sparse and directly discontinuous with each other. That is, when the annealing temperature is 500°C, the temperature is high. During the annealing process, the nanowires that are close to each other are fused and become a thin film structure, and only a few nanowires are not fused.
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