Composition for flexible substrate and flexible substrate

A flexible substrate and composition technology, applied in the direction of circuit substrate materials, coatings, printed circuit components, etc., can solve the problems of poor moisture absorption resistance, unsatisfactory moisture absorption resistance, and poor stability. The effect of anti-hygroscopicity

Active Publication Date: 2014-06-18
CHI MEI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the silane-modified polyamic acid resin has poor stability when exposed to heat, and the partial condensate of silane will detach from the polyamic acid resin, resulting in poor moisture absorption resistance of the composition in the subsequent flexible substrate. Therefore, the silane-modified polyamic acid resin composition is applied on flexible substrates such as flexible liquid crystal displays or e-books, and its moisture resistance still cannot meet the needs of the industry.

Method used

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  • Composition for flexible substrate and flexible substrate
  • Composition for flexible substrate and flexible substrate
  • Composition for flexible substrate and flexible substrate

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0039] The preparation method of the polyamic acid resin comprises the following steps: a mixture of a tetracarboxylic dianhydride component and a diamine component comprising a bicyclic alicyclic tetracarboxylic dianhydride compound and a fluorine-containing tetracarboxylic dianhydride compound Dissolve in a solvent, carry out polymerization reaction at a temperature of 0°C to 100°C and react for 1 hour to 24 hours, and then carry out vacuum distillation of the above reaction solution with an evaporator to obtain a polyamic acid resin, or The above reaction solution is poured into a large amount of poor solvent to obtain a precipitate, and then the precipitate is dried under reduced pressure to obtain a polyamic acid resin.

[0040] Preferably, based on the total number of moles of the diamine component being 100 moles, the amount of the tetracarboxylic dianhydride component used ranges from 20 moles to 200 moles; more preferably, the tetracarboxylic dianhydride component The...

Synthetic example 1

[0119] A nitrogen inlet, a stirrer, a condenser and a thermometer are set on a four-necked conical flask with a capacity of 500 milliliters, and nitrogen is introduced, and the feed composition is added to include: 2.70 grams (0.025 moles) of p-phenylenediamine, 4.95 grams (0.025 moles) ) of 4,4'-diaminodiphenylmethane and 80 g of nitrogen-methyl-2-pyrrolidone were stirred at room temperature until dissolved. Then add 6.20 grams (0.025 moles) of bicyclo[2.2.2]oct-2-ene-2,3,5,6-tetracarboxylic dianhydride, 8.85 grams (0.025 moles) of 3,6-bis(trifluoro Methyl)-1,2,4,5-pyridine tetracarboxylic dianhydride and 20 grams of nitrogen-methyl-2-pyrrolidone were reacted at room temperature for 2 hours. After the reaction, the reaction liquid was poured into 1500 ml The polymer was precipitated in water, and the filtered polymer was washed with methanol and filtered three times, placed in a vacuum oven, and dried at a temperature of 60°C to obtain the polyamic acid resin (A-1-1).

[012...

Synthetic example 2

[0121] Synthesis examples 2 to 3 are to prepare the polyamic acid resin with the same steps as in synthesis example 1, the difference is: change the type and usage amount of tetracarboxylic dianhydride component and diamine component, as shown in Table 1 shown.

[0122] [Preparation of polyimide resin]

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Abstract

The invention relates to a composition for a flexible substrate and the flexible substrate. The composition for the flexible substrate includes a polymer and a solvent. The polymer is selected from the polyamic acid, polyimide, and a combination thereof, and is obtained by subjecting a mixture including a tetracarboxylic dianhydride component and a diamine component to a reaction. The tetracarboxylic dianhydride component includes a bicyclic alicyclic tetracarboxylic dianhydride compound and a fluorine-containing tetracarboxylic dianhydride compound. The bicyclic alicyclic tetracarboxylic dianhydride compound is in an amount ranging from 30 mole % to 70 mole % and the fluorine-containing tetracarboxylic dianhydride compound is in an amount ranging from 30 mole % to 70 mole % based on 100 mole % of the tetracarboxylic dianhydride component.

Description

technical field [0001] The present invention relates to a composition for a flexible substrate, in particular to a composition for a flexible substrate comprising a polymer, and the polymer is formed by reacting a mixture comprising a tetracarboxylic dianhydride component and a diamine component be made of. The tetracarboxylic dianhydride component includes a bicyclic alicyclic tetracarboxylic dianhydride compound and a fluorine-containing tetracarboxylic dianhydride compound. Background technique [0002] In recent years, organic polymer materials have been widely used in various electronic components or devices to improve various properties of electronic components or devices (such as electrical insulation, heat resistance or mechanical properties, etc.). Polyimide polymer is the most widely used, because of its excellent mechanical properties and good electrical properties, it is preferred by related industries. [0003] Japanese Patent Laid-Open No. 2002-293933 disclos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/10H05K1/03
CPCC08K3/36C08K5/13C08G69/42C08L79/085C08G69/265C08G73/1042C08G73/1046C08L79/08H05K1/0346H05K1/0373C08L2203/20C09D179/08C08G73/1039C08G73/105C08G73/1075C08G73/1078C08K3/013
Inventor 梁育豪
Owner CHI MEI CORP
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