Adhesion assisting agent-bearing metal foil, printed wiring board using the same and manufacturing method thereof

A printed circuit board and auxiliary agent technology, applied in the field of metal foil, can solve the problems of good high-frequency characteristics, and achieve the effects of good high-frequency characteristics, high reliability, and improved adhesion

Active Publication Date: 2009-09-09
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In the conventional technology, there is no wiring board that is excellent in fine wiring formation, electrical characteristics, and manufacturing cost, and has high reliability and high frequency characteristics.

Method used

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  • Adhesion assisting agent-bearing metal foil, printed wiring board using the same and manufacturing method thereof
  • Adhesion assisting agent-bearing metal foil, printed wiring board using the same and manufacturing method thereof
  • Adhesion assisting agent-bearing metal foil, printed wiring board using the same and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0201] Metal foil A described below was produced.

[0202] (metal foil A)

[0203] Under the following conditions, the glossy surface of electrolytic copper foil (carrier copper foil) with a width of 510 mm and a thickness of 35 μm was continuously plated with chrome to form a 1.0 mg / dm 2 Thick chrome plating (stripping layer). The surface roughness Rz after the chromium plating layer was formed was 0.5 μm. The surface roughness was measured according to JIS-B-0601.

[0204] Chrome Plating Condition

[0205] Solution composition: chromium trioxide 250g / L, sulfuric acid 2.5g / L

[0206] Bath temperature: 25°C

[0207] Anode: lead

[0208] Current density: 20A / dm 2

[0209] Next, copper electroplating with a thickness of 2.0 μm was performed under the following gloss plating conditions. The surface roughness of the metal foil after copper electroplating is Rz=0.6 μm.

[0210] Sulfuric acid copper plating conditions

[0211] Solution composition: copper sulfate pentahydra...

Embodiment 2

[0279] When making resin composition A in embodiment 1, the consumption of the novolac type epoxy resin (NC3000S-H) with biphenyl structure is changed from 80 parts by weight to 82.8 parts by weight, and the cresol novolac containing triazine ring The amount of type phenolic resin (Feenolite EXB-9289) was changed from 9 parts by weight to 12.2 parts by weight. Others are all the same as embodiment 1 to make a printed circuit board.

Embodiment 3

[0281] A printed wiring board was produced in the same manner as in Example 1 except that the thickness of the resin composition A was changed from 2.0 μm to 5 μm when producing the metal foil B in Example 1.

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Abstract

The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 mum. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Description

[0001] The present invention is a divisional application of the invention with the application number 200510005127.3, the application date being January 28, 2005, and the invention title being: metal foil with adhesion auxiliary agent, printed circuit board and its manufacturing method. technical field [0002] The present invention relates to a metal foil with an adhesion aid, a printed wiring board and a method for manufacturing the printed wiring board. Furthermore, the present invention relates to a multilayer wiring board, a semiconductor chip mounting substrate, and a semiconductor packaging substrate. Background technique [0003] In recent years, the demand for miniaturization, weight reduction, and high speed of electronic equipment has increased, and the density of printed circuit boards has continued to increase. In recent years, the method of manufacturing printed circuit boards by the semi-additive method using electroplating has attracted attention. [0004] Ja...

Claims

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Application Information

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IPC IPC(8): H05K3/38H05K3/46H05K3/28C09J7/00C09J163/00H05K1/09B32B15/08B32B15/092C09J7/02C09J11/08
Inventor 高井健次森池教夫上山健一渡边贵子高根泽伸森田高示增田克之长谷川清
Owner HITACHI CHEM CO LTD
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