A kind of electroless copper plating solution for micropore filling and preparation method thereof

A technology of electroless copper plating and solution, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve problems such as voids, and achieve the effects of good quality, rapid chemical copper filling, and stable solution

Inactive Publication Date: 2016-09-21
湖南省鎏源新能源有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But at present, in the filling of actual trenches or micropores, defects such as voids often appear

Method used

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  • A kind of electroless copper plating solution for micropore filling and preparation method thereof
  • A kind of electroless copper plating solution for micropore filling and preparation method thereof
  • A kind of electroless copper plating solution for micropore filling and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Add 18g of copper sulfate pentahydrate and 20g of glyoxylic acid into a beaker, add 900mL of distilled water, stir until the solid is completely dissolved, then add 22g of EDTA, 0.001g of accelerator thiourea propylsulfonate, and inhibitor polyethylene glycol (MW3000) 0.005g, NaOH 2.0g, stir evenly, dilute to 1L with distilled water, and prepare electroless copper plating solution 1.

Embodiment 2

[0027] Add 20g of copper sulfate pentahydrate and 10g of glyoxylic acid into a beaker, add 900mL of distilled water, stir until the solid is completely dissolved, then add 30g of EDTA, 0.0005g of accelerator thiourea propylsulfonate, and inhibitor polyethylene glycol (MW4000) 0.002g, NaOH3.5g, stir evenly, dilute to 1L with distilled water, and prepare electroless copper plating solution 2.

Embodiment 3

[0029] Add 5g of copper sulfate pentahydrate and 5g of glyoxylic acid into a beaker, add 900mL of distilled water, stir until the solid is completely dissolved, then add 10g of EDTA, 0.002g of accelerator isothiourea propylsulfonate, inhibitor polyethylene glycol (MW3000 ) 0.003g, NaOH 1.5g, stir evenly, dilute to 1L with distilled water, and prepare electroless copper plating solution 3.

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Abstract

The invention discloses a chemical copper plating solution for micropore filling and a preparation method thereof. 1 L of the chemical copper plating solution comprises the following raw materials by mass ratio: 5-20 g / L of copper sulfate pentahydrate, 10-30 g / L of EDTA, 5-20 g / L of glyoxylic acid, 0.0005-0.002 g / L of accelerating agent, 0.001-0.02 g / L of inhibitor, 1.5-3.5 g / L of NaOH and the balance of distilled water, wherein the accelerating agent is one of thiourea propyl sulfonate and an isomeride and a derivative thereof; the inhibitor is polyethylene glycol with average molecular weight between 3000 and 8000. According to the chemical copper plating solution, the imporous, seamless and perfect chemical copper filling of a micropore is fast realized in such a way that the accelerating agent is added to the chemical copper plating solution. The chemical copper plating solution disclosed by the invention has the advantages of stability and good quality of a deposited copper membrane.

Description

technical field [0001] The invention belongs to the technical field of microelectronics production, and in particular relates to an electroless copper plating solution for micropore filling. Background technique [0002] Metal copper has excellent comprehensive physical and chemical properties such as electrical conductivity, thermal conductivity and solderability, and has been widely used in aviation, aerospace, petrochemical, machinery, electronics, computers, automobiles, medical and other fields. At present, the use of metal copper in more and more microelectronic devices makes the traditional electroplating copper filling technology more and more difficult. Perfect electroless copper plating replaces electroplating copper filling to complete the production of finer microelectronic devices. The essence of chemical filling copper plating is to fill copper without voids and gaps in trenches or micropores. But at present, in the filling of actual trenches or micropores, de...

Claims

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Application Information

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IPC IPC(8): C23C18/38
Inventor王旭沈秋仙白伟琴
Owner湖南省鎏源新能源有限责任公司