Modified phenol-formaldehyde resin adhesive and preparation method thereof
A technology of phenolic resin and adhesive, applied in the direction of adhesive, aldehyde/ketone condensation polymer adhesive, adhesive type, etc., can solve the problems of low peel strength, high temperature curing, high brittleness, etc., and achieve natural aging resistance Good results
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[0022] A modified phenolic resin adhesive, in parts by weight, consists of the following components:
[0023] Phenolic resin: 160, polyvinyl formal: 70,
[0024] Ethyl orthosilicate: 30, Propyl gallate: 5,
[0025] Hexamethylenetetramine: 4, Triethanolamine: 3,
[0026] Ethyl acetate: 400, absolute ethanol: 60.
[0027] The preparation method of described modified phenolic resin adhesive comprises the following technical steps:
[0028] (1) Dissolve polyvinyl formal and hexamethylenetetramine in ethyl acetate according to the proportion, and stir to completely dissolve the solid matter;
[0029] (2) Dissolve propyl gallate in absolute ethanol and disperse evenly;
[0030] (3) Add the product of step (2) to the product of step (1), and then add the remaining components one by one, stir and disperse evenly to obtain the finished product.
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