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An rc trigger type esd protection circuit for integrated circuits

An ESD protection and integrated circuit technology, applied in the field of electronics, can solve the problems of large chip area, large resistance and capacitance occupied by the RC trigger ESD protection circuit, and achieve the effect of reducing the layout area and reducing the leakage current.

Inactive Publication Date: 2016-04-06
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention aims at the technical problem that the RC time constant of the RC trigger circuit in the conventional RC trigger ESD protection circuit used for integrated circuits is relatively large, requiring relatively large resistance and capacitance, thus causing the RC trigger ESD protection circuit to occupy too large a chip area. , providing an RC trigger ESD protection circuit for integrated circuits

Method used

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  • An rc trigger type esd protection circuit for integrated circuits
  • An rc trigger type esd protection circuit for integrated circuits
  • An rc trigger type esd protection circuit for integrated circuits

Examples

Experimental program
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Embodiment 1

[0024] An RC trigger type ESD protection circuit for integrated circuits, such as figure 2 As shown, it includes: an RC trigger circuit 103 and a substrate triggered SCR device 104 . The trigger circuit 103 includes a resistor 305 , a capacitor 302 , two PMOS transistors 301 and 303 , and an NMOS transistor 304 . The source of the first PMOS transistor 301 is connected to the VDD power supply line 101, its drain is connected to the VSS power supply line 102 through a capacitor 302, and its grid is connected to the drain of the second PMOS transistor 303 and the gate of the NMOS transistor 304; the first PMOS transistor The drain of 301 and the connection point 306 of the capacitor 302 are connected to the gate of the second PMOS transistor 303 and the drain of the NMOS transistor 304; the source of the second PMOS transistor 303 is connected to the VDD power line 101, and the source of the NMOS transistor 304 is connected to VSS Power supply line 102; the drain of the second...

Embodiment 2

[0027] Such as image 3 As shown, the third PMOS transistor 308 is added on the basis of Embodiment 1, wherein the drain of the first PMOS transistor 301 is not directly connected to the capacitor 302, and the drain of the first PMOS transistor 301 is connected to the source of the third PMOS transistor 308, The drain of the third PMOS transistor 308 is connected to the VSS power supply line 102 through the capacitor 302, and the gates of the first PMOS transistor 301 and the third PMOS transistor 308 are interconnected and connected to the drain of the second PMOS transistor 303 and the gate of the NMOS transistor 304 . image 3 The technical solution shown is equivalent to using two series-connected PMOS transistors to replace figure 2 The first PMOS tube 301 in the technical solution shown, so that figure 2 The turn-on resistance of the technical solution shown is doubled, but the capacitance can be reduced to one-half of the original, which can further reduce the chip ...

Embodiment 3

[0032] Such as Image 6 As shown, on the basis of Embodiment 1 or 2, the resistor 305 is replaced by two or more resistors 305 in series to drive two or more substrate-triggered SCR devices 104 in series, thereby increasing the ESD condition The lower holding voltage prevents latch-up from occurring.

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Abstract

The invention provides an RC trigger type ESD protection circuit for an integrated circuit, and belongs to the electronic technical field. According to the RC trigger type ESD protection circuit for the integrated circuit, a second PMOS transistor 303 is started through the delay action of an RC trigger circuit which is composed of a starting resistor and a capacitor of a first PMOS transistor, the electric potential of a potential point 307 is pulled up through the current of a resistor 305, so that an NMOS transistor 304 is started, and the electric potential of the potential point 307 is lowered. An NMOS transistor 303 and the second PMOS transistor 303 form positive feedback, and the high potential of the potential point 307 is guaranteed, so that a substrate is driven to trigger an SCR device 104. According to the RC trigger type ESD protection circuit for the integrated circuit, only a 5fF capacitor is needed, the 5fF capacitor is much smaller than a pF level capacitor in a traditional trigger circuit, the domain area is reduced accordingly, and leak currents are reduced accordingly.

Description

technical field [0001] The invention belongs to the field of electronic technology, and relates to an electrostatic discharge (ElectroStatic Discharge, ESD for short) protection circuit technology for semiconductor integrated circuit chips, in particular to an RC trigger type ESD protection circuit for integrated circuits. Background technique [0002] In the process of integrated circuit production, packaging, testing, storage, and handling, electrostatic discharge, as an inevitable natural phenomenon, is ubiquitous. With the reduction of the feature size of integrated circuit technology and the development of various advanced technologies, it is more and more common for integrated circuits to be damaged by ESD phenomena. Relevant research and surveys have shown that 30% of integrated circuit failure products are due to electrostatic discharge. caused by. Therefore, it is very important to use high-performance ESD protection devices to protect integrated circuit circuits. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/02H01L23/60
Inventor 乔明马金荣齐钊石先龙曲黎明张波
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA