Branched organosilicon epoxy resin curing agent and epoxy curing system

A technology of silicon epoxy resin and epoxy resin, which is applied in the direction of organic chemistry, chemical instruments and methods, compounds of group 4/14 elements of the periodic table, etc., can solve the problems of reduced electron cloud density, low reactivity, epoxy cross Bonding density and mechanical properties, etc., to achieve the effect of outstanding bonding performance and bending strength, wide application, and high dielectric strength

Active Publication Date: 2014-07-16
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of curing agent has excellent flame retardant properties, but its disadvantage is that due to the strong electron-withdrawing effect of the P=O group, the -NH 2 The density of the electron cloud on the group is reduced, so that the reactivity is lower, resulting in the cured epoxy crosslink density and mechanical properties being affected

Method used

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  • Branched organosilicon epoxy resin curing agent and epoxy curing system
  • Branched organosilicon epoxy resin curing agent and epoxy curing system
  • Branched organosilicon epoxy resin curing agent and epoxy curing system

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preparation example Construction

[0040] The present invention also provides a preparation method of the silicone epoxy resin curing agent, comprising:

[0041] Using compound (II) as raw material, directly drop it into compound (III) or their mixture under stirring, control the reaction temperature at 60-100°C, and the reaction time is 1-3h. After the reaction is completed, separate the lower curing agent layer, and Distill under reduced pressure to remove the raw materials to obtain compound (I) with a yield greater than 90%.

[0042]

[0043] R 4 -NH 2

[0044] (III)

[0045]Among them, X and Y are integers greater than 0, and R1, R2, and R3 are functional groups composed of one or more of the following chemical molecular structures: -H, -C n h 2n+1 , -NH 3 , -COOH, -SH, -C n h 2n -, -NH-, -COO-, Wait.

[0046] The present invention also provides an epoxy curing system comprising the branched silicone epoxy resin curing agent, in parts by weight, comprising:

[0047] 100 parts by weight...

Embodiment 1

[0060] Take the compound (II) with X=1, Y=1, R1, R2, and R3 as methyl groups as the raw material, directly drop it into the solution of p-phenylenediamine under stirring, control the reaction temperature at 60-70°C, and react Time 3h. After the reaction, the lower curing agent layer was separated, and the reaction raw materials were evaporated under reduced pressure to obtain No. (1) branched silicone epoxy resin curing agent with a yield of 92%.

[0061] Take 100 parts by weight of E-44 epoxy resin, 15 parts by weight of No. 1 curing agent, 0.4 parts by weight of 2-methylimidazole, stir for 0.5-1 hour and mix evenly, according to GB-T7124-1986 (Test of adhesive tensile shear strength Method) Spread evenly on the surface of the steel sheet cleaned with acetone and fix it, cure at 80°C for 30 minutes, and cure at 150°C for 1.5 hours. The bond strength was tested to be 13.5MPa, and the tensile modulus at the bond was 3230MPa.

[0062] Stir the resin, curing agent, and curing a...

Embodiment 2

[0064] Take compound (II) with X=1, Y=1, R1, R2, and R3 as methyl groups as the raw material, and directly drop it into aniline under stirring, control the reaction temperature at 70-80°C, and the reaction time is 3h. After the reaction, the lower curing agent layer was separated, and the reaction raw materials were distilled off under reduced pressure to obtain No. (2) branched silicone epoxy resin curing agent with a yield of 94%.

[0065] Take 100 parts by weight of E-44 epoxy resin, 35 parts by weight of No. 2 curing agent, 0.4 parts by weight of triethanolamine, stir for 0.5-1 hour to mix evenly, according to GB-T7124-1986 (Test method for tensile shear strength of adhesives) Apply to the surface of the steel sheet cleaned with acetone and fix it, cure at 80°C for 30 minutes, and cure at 150°C for 1.5 hours. Its bond strength is 11.8MPa, and the tensile modulus of the bond is 2650MPa.

[0066] Stir the resin, curing agent, and curing accelerator uniformly according to th...

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Abstract

The invention discloses a branched organosilicon epoxy resin curing agent and an epoxy curing system. The curing agent can improve the impact resistance, the adhesive property and the bending strength of an epoxy resin product and the toughness of epoxy resin. The epoxy curing system comprises the branched organosilicon epoxy resin curing agent and particularly comprises the following main components in parts by weight: 100 parts of epoxy resin, 5-80 parts of branched organosilicon epoxy resin curing agent and 0-20 parts of curing accelerator. The curing agent disclosed by the invention is a transparent liquid with low viscosity at normal temperature and is easy to be uniformly mixed with epoxy resin, and can be used for curing most types of epoxy resin. An epoxy resin casting body prepared by the curing agent is transparent and free from bubbles. The curing agent can cure most epoxy resins at low temperatures in range of 20-100 DEG C, and the epoxy resin solid lower than 100 DEG C is a colorless transparent solid. The property of the curing agent can be adjusted by changing the type and quantity of active groups on the curing agent or adjusting the length of the chain segment of siloxane. The curing agent is wide in application.

Description

technical field [0001] The invention relates to the application field of epoxy resin, in particular to a branched silicone epoxy resin curing agent and an epoxy curing system containing it. Background technique [0002] Epoxy resins have developed into a large class of thermosetting resins due to their excellent mechanical and electrical properties and are widely used in adhesives, structural composite materials, electronic semiconductor packaging and other fields. Among them, the curing agent has a greater influence on its performance. The curing agents that are widely used today mainly include organic amines, organic acid anhydrides, imidazoles, etc. Among them, amine curing agents are the most widely used due to their variety and easy control of performance. However, traditional low-molecular-weight amines such as ethylenediamine have the disadvantage of being volatile, causing great harm to construction workers, and the epoxy resin cured with this amine has poor impact ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/388C07F7/10C08G59/50
Inventor 范宏曹骏李诚
Owner ZHEJIANG UNIV
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