Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of znalmgin high temperature lead-free solder

A lead-free solder, high temperature technology, used in welding/cutting media/materials, welding media, metal processing equipment, etc., can solve the problem that it is difficult to process into strips or filaments, the melting point of the alloy is not significantly reduced, and the melting point of the alloy is reduced. and other problems, to achieve the effects of high microhardness and tensile strength, good wettability and suitable melting point

Inactive Publication Date: 2016-08-17
BEIJING UNIV OF TECH
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the literature reports that the lead-free solder Zn4Al3Mg3Ga has been successfully applied to practice, but due to the poor ductility of the solder, it is difficult to process it into a strip or filament; the literature reports that the addition of Cu to the alloy melting point of the ZnAlCu alloy solder does not significantly decrease; Zn12Al -xIn (x=0.5~1.5at.%) alloy solder, the addition of In improves the wettability of the alloy, but the melting point of the alloy does not decrease significantly

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of znalmgin high temperature lead-free solder
  • A kind of znalmgin high temperature lead-free solder
  • A kind of znalmgin high temperature lead-free solder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Embodiment 1: In this embodiment, a high-temperature solder for primary packaging of electronic products is composed of the following components in mass percentage: Al4.0, Mg3.0, and the balance is Zn.

Embodiment 2

[0014] Embodiment 2: In this embodiment, a high-temperature solder for primary packaging of electronic products is composed of the following components in mass percentage: Al4.0, Mg3.0, In1.0, and the balance is Zn.

Embodiment 3

[0015] Embodiment 3: In this embodiment, a high-temperature solder for primary packaging of electronic products is composed of the following components in mass percentage: Al4.0, Mg3.0, In1.5, and the balance is Zn.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
Login to View More

Abstract

The invention relates to ZnAlMgIn high temperature lead-free solder, and belongs to the technical field of manufacturing lead-free solder for electronic first-grade encapsulation in the micro-electronic industry. The ZnAlMgIn high temperature lead-free solder comprises (by mass) 3.9 to 4.1 percent of Al, 2.4 to 3.1 percent of Mg, 0.5 to 3.0 percent of In, or 0.05 to 1.0 percent of P, and the balancing Zn. The ZnAlMgIn high temperature lead-free solder is smelted with a fused salt protection method, alloy burning losses are small, and texture is even. According to the ZnAlMgIn high temperature lead-free solder, on the basis of Zn4Al3Mg near-eutectic alloy, the elements of In and P are proposed to be added in a micro amount to lower the melting point of the alloy and improve the oxidation resistance and wettability of the alloy. The ZnAlMgIn high temperature lead-free solder is low in cost, free from toxic elements such as Pb, good in wettability, good in mechanical property and capable of meeting the requirement for replacing traditional high-lead solder.

Description

Technical field: [0001] The invention relates to high-temperature lead-free solder in the field of soldering, which is a new type of ZnAlMg-xIn lead-free solder, belongs to the technical field of lead-free solder for electronic primary packaging in the microelectronics industry, and is also used in automotive circuit board soldering Welding and household appliances welding field. Background technique: [0002] With the development of society, people have higher and higher requirements for environmental protection and health. The EU RoHS Directive and my country's "Administrative Measures for Pollution Control of Electronic Information Products" have stipulated that the use of lead-containing solders is prohibited. Lead-containing high-temperature solders Pb5Sn and Pb10Sn (melting points are 305°C and 310°C, respectively) have not found suitable lead-free substitute solders. At present, the research on high-temperature lead-free solders mainly focuses on the following system...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/28
CPCB23K35/282
Inventor 杨晓军闫鑫胡伟雷永平
Owner BEIJING UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com