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A packaging method for a photosensitive chip and a packaging structure using the packaging method

A photosensitive chip and packaging method technology, applied in radiation control devices, etc., can solve the problems of high process cost, process cost reduction, photosensitive chip packaging pollution, etc., and achieve simplified packaging process, reduced packaging cost, and reduced requirements for process capability Effect

Active Publication Date: 2016-10-12
深圳明阳芯蕊半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the TSV technology of the prior art has solved the problem of pollution in the photosensitive chip package, the process cost is high
The reduction of pollution rate and process cost in the optical area cannot be guaranteed at the same time

Method used

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  • A packaging method for a photosensitive chip and a packaging structure using the packaging method
  • A packaging method for a photosensitive chip and a packaging structure using the packaging method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for encapsulating a photosensitive chip, the manufacturing method comprising the following steps: Process 1: protecting the photosensitive area of ​​the photosensitive chip; wherein, the step of protecting the photosensitive area further includes the following steps: first, a transparent IR glass 1 is provided, and the photosensitive area is protected by photolithography. Form a wall structure on the IR glass 1 to make a walled glass; then cut the walled glass to form a single optical cover; according to the size and shape of the photosensitive chip 3 wafer, reshape the optical cover on a glued substrate 2 First, form an optical glass that matches the photosensitive chip 3 wafer; Step 2: Thinning and cutting, and dividing the photosensitive chip into individual chips; Step 3: Encapsulation by WireBond process.

[0024] The finally formed CIS packaging structure includes IR glass 1, bonding wire 6, substrate 2, photosensitive chip 3, CV wall 4 and pad 7, photosen...

Embodiment 2

[0025] Embodiment 2, the rest is the same as the above-mentioned embodiment 1, the difference is that the above process 1 and process 2 can also be to first thin the photosensitive chip, then protect the photosensitive area of ​​the photosensitive chip, and then thin and protect the photosensitive Regions of the photosensitive chip are diced into individual chips.

Embodiment 3

[0026] Embodiment 3, the rest is the same as the above-mentioned embodiment 1, the difference is that in the above-mentioned step 1, to protect the photosensitive area of ​​the photosensitive chip, 1000 angstroms of aluminum or silicon dioxide can also be deposited first.

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Abstract

The invention provides a light-sensing chip encapsulation method and an encapsulation structure adopting the same. In the process of encapsulation, a special process is adopted to protect a light-sensing area of the light-sensing chip so as to ensure the light-sensing area of the light-sensing chip to be less prone to being polluted. In the implementing process of encapsulation, the special protection process is adopted, so that product yield is increased, requirements on structure manufacturing environment and process capability are lowered, encapsulation process is simplified, and product encapsulation cost is lowered.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a packaging method for a photosensitive chip and a packaging structure using the packaging method. Background technique [0002] The photosensitive chip is an imaging device used to perform digital electronic images. As it is mainly used in mobile phone cameras and other imaging devices, the circuit in it converts light energy into voltage, and then converts it into digital signals for processing. The initial sub-micron semiconductor The mature process technology makes the image sensor become the focus of attention. [0003] In the prior art, due to the rapid development of semiconductor packaging technology, various chips can protect the chip and prevent the chip from getting wet through the packaging technology, and guide the wires of the chip to connect with the wires of the printed circuit board. [0004] The traditional chip packaging process is as follows: First, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146
Inventor 田丽平
Owner 深圳明阳芯蕊半导体有限公司