Bonding wire annealing system

A bonding wire and annealing technology, used in furnaces, heat treatment equipment, heat treatment furnaces, etc., can solve the problem that the annealing system is difficult to meet the demand, and achieve the effect of high smoothness and precision

Active Publication Date: 2014-10-01
青岛桦晟琪科技有限公司
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  • Abstract
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Problems solved by technology

[0004] Among them, "the dimensional accuracy should be high and uniform, without bending; the surface should be smooth, free from stains, and without scars" has strict requirements on the annealing process. The general processing range of the existing technology is above Φ0.05mm. When using wire or metal wire, the existing annealing system is difficult to meet the demand

Method used

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Embodiment Construction

[0037] The present invention will be further described in detail below in conjunction with the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0038] Such as figure 1 As shown, it is a preferred embodiment of a bonding wire annealing system of the present invention. This machine is mainly used for annealing gold wires of Φ0.015 to Φ0.05mm and other metal wires, etc., including: a wire-feeding system 1, composed of The metal wire released by the pay-off system enters an annealing furnace 2 for annealing, and the annealed metal wire is cooled by a drop device 3, and the cooled metal wire enters a dryer 4 for drying, and the dried metal wire is The wire enters a take-up system 5, and all the above-mentioned systems are controlled by a main control system 6, which is composed of PLC and touch screen.

[0039] Such as figure 2 , image 3 As shown, it is the outline drawing of the pay-off system and the winding m...

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Abstract

The invention provides a bonding wire annealing system which is convenient and fast to operate, high in processing precision, and good in finished product cleanness. The aim is realized through the following technical scheme: the bonding wire annealing system is characterized by comprising a pay-off system, a metal wire released by the pay-off system is annealed in an annealing furnace, the annealed metal wire is cooled in a liquid dropping device, the cooled metal wire is dried in a drying machine, the dried metal wire enters a take-up system, all the systems are controlled by a control system consisting of a PLC (Programmable Logic Controller) and a touch screen.

Description

technical field [0001] The invention belongs to the technical field of annealing, and relates to a bonding wire annealing system. [0002] Background technique [0003] Bonding wires are mainly used in the connection of transistors, integrated circuits and other semiconductor devices and electrode parts of microelectronic packages or chips and external leads. Although there are bonding methods that do not use bonding wires, 90% of IC products are still packaged with bonding wires. The resistance of the bonding wire welding point, the space occupied in the chip and wafer, the gap required for welding, the conductivity per unit volume, the elongation rate of the bonding wire, chemical properties, corrosion resistance and metallurgical properties must meet Certain requirements are required to obtain good bonding properties. Specifically, the bonding wire used for bonding should have the following characteristics: high dimensional accuracy and uniformity, no bending; smooth s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C21D9/56
Inventor 苗志强
Owner 青岛桦晟琪科技有限公司
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