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Transparent organosilicone glue for COB (chip on board)-LED (light-emitting diode) encapsulation and preparation method thereof

A technology of COB-LED and organic silica gel, which is applied in the direction of adhesives, adhesive additives, electrical components, etc., can solve the problems of yellowing, poor adhesion of silicone potting adhesives, and affecting aesthetics, etc., to achieve good hardness and adhesion Excellent performance and light transmittance

Active Publication Date: 2014-11-05
惠州市永卓科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the commonly used potting compounds on the market are mainly epoxy resin potting compound, polyurethane potting compound and silicone potting compound. The commonly used epoxy resin potting glue will turn yellow when exposed to high temperature, which not only affects the perspective of LED lights, but also affects the aesthetics; the hardness of polyurethane potting glue cannot be very low, and the product can only be used for Epoxy type or Semi-sleeved flexible light strips, as the temperature drops, the flexibility of the light strips changes greatly; the silicone potting glue has poor adhesion, etc.

Method used

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  • Transparent organosilicone glue for COB (chip on board)-LED (light-emitting diode) encapsulation and preparation method thereof
  • Transparent organosilicone glue for COB (chip on board)-LED (light-emitting diode) encapsulation and preparation method thereof
  • Transparent organosilicone glue for COB (chip on board)-LED (light-emitting diode) encapsulation and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A transparent organic silica gel for COB-LED potting, the raw material formula of which is composed of the following components by weight:

[0033]

[0034]

[0035] Wherein, the base material is vinyl silicone oil with a viscosity of 9000mpa s; the structural formula of the base material is as shown in general formula (I):

[0036]

[0037] In the above general formula (I), m=300, n=300.

[0038] Wherein, the modified MQ resin is vinyl MQ resin, and the vinyl content is 3%;

[0039] The hydrogen content of the hydrogen-containing silicone oil is 0.9%; the structural formula of the hydrogen-containing silicone oil is shown in general formula (II):

[0040]

[0041] In the above general formula (II), p=75, q=50;

[0042] The inhibitor uses 1-butyn-3-alcohol;

[0043] The catalyst is Castel platinum catalyst (chemical name: platinum (O) divinyltetramethyldisiloxane solution), and the platinum content is 3000 pmm;

[0044] The coupling agent is 3-(2,3 glyci...

Embodiment 2

[0049] A transparent organic silica gel for COB-LED potting, the raw material formula of which is composed of the following components by weight:

[0050]

[0051] Wherein, the base material is vinyl silicone oil with a viscosity of 8000mpa s; the structural formula of the base material is as shown in general formula (I):

[0052]

[0053] In the above general formula (I), m=300, n=300.

[0054] Wherein, the modified MQ resin is vinyl MQ resin, and the vinyl content is 3%;

[0055] The hydrogen content of the hydrogen-containing silicone oil is 0.9%; the structural formula of the hydrogen-containing silicone oil is shown in general formula (II):

[0056]

[0057] In the above general formula (II), p=90, q=70;

[0058] The inhibitor uses 1-butyn-3-alcohol;

[0059] The catalyst is Castel platinum catalyst (chemical name: platinum (O) divinyltetramethyldisiloxane solution), and the platinum content is 3000 pmm;

[0060] The coupling agent is 3-(2,3 glycidoxy)propylt...

Embodiment 3

[0065] A transparent organic silica gel for COB-LED potting, the raw material formula of which is composed of the following components by weight:

[0066]

[0067] Wherein, the base material is vinyl silicone oil with a viscosity of 8500mpa s; the structural formula of the base material is as shown in general formula (I):

[0068]

[0069]In the above general formula (I), m=400, n=200.

[0070] Wherein, the modified MQ resin is vinyl MQ resin, and the vinyl content is 2%;

[0071] The hydrogen content of the hydrogen-containing silicone oil is 0.8%; the structural formula of the hydrogen-containing silicone oil is shown in general formula (II):

[0072]

[0073] In the above general formula (II), p=55, q=55;

[0074] The inhibitor uses 1-hexyn-3-ol;

[0075] The catalyst is Castel platinum catalyst (chemical name: platinum (O) divinyltetramethyldisiloxane solution), and the platinum content is 3000 pmm;

[0076] The coupling agent is 3-(2,3 glycidoxy)propyltrimeth...

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Abstract

The invention belongs to the field of organosilicone encapsulation glue, and discloses transparent organosilicone glue for COB (chip on board)-LED (light-emitting diode) encapsulation and a preparation method thereof. The raw material formulation of the transparent organosilicone glue for COB-LED encapsulation comprises the following components in parts by weight: 50-70 parts of a base material; 20-40 parts of modified MQ resin; 2-8 parts of hydrogen-containing silicone oil; 0.01-0.06 part of an inhibitor, 0.1-0.5 part of a catalyst and 0.5-1.5 part of a coupling agent, and the base material is vinyl silicone oil. The preparation method is as follows: the base material, the modified MQ resin, the hydrogen-containing silicone oil, the inhibitor, the catalyst and the coupling agent are mixed and stirred evenly, then vacuumized for deaeration, then encapsulated, and then cured to prepare the transparent organosilicone glue for COB-LED encapsulation. The transparent organosilicone glue for COB-LED encapsulation is good in hardness, high temperature resistant and non-yellowing, excellent in adhesion and transmittance, and environmentally-friendly and by-product-free.

Description

technical field [0001] The invention belongs to the field of silicone potting glue, and relates to a silicone potting glue for chip on board packaging (Chip On Board, BOD), in particular to a transparent organic silica gel for COB-LED potting and a preparation method thereof . Background technique [0002] LED light bar, also known as LED light strip, is shaped like a belt, and its application is very wide, suitable for decoration and lighting such as car decoration, signs, advertising signs, wine cabinets, jewelry cabinets, entertainment places, path and outline signs, etc. Combination of different LED colors to show the perfect visual effect. [0003] COB packaging is a direct chip mounting technology, which is a process in which the bare chip is directly pasted on the printed circuit board, then wire bonded, and then the chip and the lead are encapsulated and protected with organic glue. [0004] COB-LED light source has the advantages of high efficiency, low loss, long...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/06H01L33/56
Inventor 王细平
Owner 惠州市永卓科技有限公司
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