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Powdered sealing agent, and sealing method

A powder, sealant technology, applied in chemical instruments and methods, adhesives, electrical components, etc., can solve problems such as damage to equipment reliability and easy damage to electronic components, so as to achieve the effect of not damaging reliability and preventing weather resistance deterioration.

Inactive Publication Date: 2014-11-05
DAICEL EVONIK LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, since the above-mentioned powder coating is melted and sprayed at high temperature, when it is used for sealing electronic components, the electronic components may be easily damaged and the reliability of the equipment may be impaired.

Method used

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  • Powdered sealing agent, and sealing method
  • Powdered sealing agent, and sealing method
  • Powdered sealing agent, and sealing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0135] For copolyamide (VESTAMELT X1051, manufactured by Evonik, containing C 10-14 Alkylene, melting point 130°C (DSC), melt flow rate 15g / 10min (temperature 160°C and load 2.16kg)) were frozen and pulverized, and classified using a metal mesh with a pore size of 60μm to obtain an average particle size of 44μm, particle size 0.5 ~ 60μm powder resin particles. After using a metal mesh (hole size: 200μm), the resin particles are uniformly dispersed on an electronic substrate (200mm×200mm) made of glass epoxy resin, and heated in an atmosphere at a temperature of 170°C to obtain a transparent resin. coated substrate.

Embodiment 2

[0137] Copolyamide (VESTAMELT X1051) was frozen and pulverized, and classified using a metal mesh with a pore size of 80 μm to obtain powdered resin particles with an average particle diameter of 49 μm and a particle size of 0.5 to 80 μm. After the resin particles are uniformly spread on the electronic substrate (200mm×200mm) made of glass epoxy resin using a metal mesh (pore size of 200μm), it is heated in an atmosphere at a temperature of 170°C to obtain a transparent resin substrate. coated substrate.

Embodiment 3

[0139] For copolyamide (VESTAMELT X7079, manufactured by Evonik, containing C 10-14 Alkylene, melting point 130°C (DSC), freeze pulverization at a melt flow rate of 3g / 10min (temperature 160°C and load 2.16kg), and classify using a metal mesh with a pore size of 120µm to obtain an average particle size of 78µm, Powdered resin particles with a particle size of 0.5-120 μm. After the resin particles are evenly spread on the electronic substrate (200mm×200mm) made of glass epoxy resin using a metal mesh (pore size of 250μm), it is heated in an atmosphere at a temperature of 170°C to obtain a transparent resin substrate. coated substrate.

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Abstract

Provided are a sealing agent and sealing method capable of tightly sealing an electronic device at low temperatures. The sealing agent for sealing a device is configured from a copolymerized polyamide resin powder having a particle diameter of 1mm or less. The copolymerized polyamide resin powder may at least include particulate (for example copolymerized polyamide resin particles having an average particle diameter of 20-400mum), and may be configured from a mixture of the particulate and coarse particles (for example copolymerized polyamide resin particles having an average particle diameter of 450-800mum). The copolymerized polyamide resin may have crystalline properties, and the melting point or the softening point of the copolymerized polyamide resin may be 75-160°C. The copolymerized polyamide resin may be, for example, a bipolymer or a terpolymer. Furthermore, the copolymerized polyamide resin may include units derived from long chain components having C8-16 alkylene groups (for example at least one kind of component selected from C9-17 lactam and amino C9-17 alkanecarboxylic acid).

Description

technical field [0001] The present invention relates to a powdery sealant suitable for sealing equipment (or electronic equipment) such as a printed circuit board on which electronic components are mounted, and a sealing method using the powdery sealant. Background technique [0002] In order to protect precision components (or electronic equipment) such as semiconductor elements, printed circuit boards, and solar cell elements from moisture, dust, etc., sealing with resin has been practiced. As this sealing method, a known method of sealing a precision part includes disposing the precision part in a mold cavity and injecting a resin into the cavity. In this method, a thermosetting resin with low viscosity and high fluidity is often used. [0003] However, due to the addition of additives such as crosslinking agents to thermosetting resins, not only the shelf life is short, but also it takes a long time from injecting the resin into the mold cavity until the resin is cured,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/00H01L21/56H01L23/29H01L23/31
CPCH01L23/293C09K3/10H01L2924/0002C09J177/06C08L2205/02C08G69/36C09J177/02C09K2200/0667H01L21/56C08L2205/025C08L77/06C08L77/02H01L2924/00C09K3/1006Y10T428/2982C08K5/12C08K5/13C08K5/17C08K5/20C08K5/3475
Inventor 有田博昭中家芳树六田充辉
Owner DAICEL EVONIK LTD
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