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Monovalent copper electroless copper plating solution

A technology of electroless copper plating and plating solution, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of slow plating speed and high formaldehyde consumption, so as to save usage, reduce production burden, The effect of improving productivity

Inactive Publication Date: 2017-04-19
UNIV OF JINAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problems of slow plating speed and high consumption of formaldehyde in the existing electroless copper plating technology, and provides a monovalent copper electroless copper plating solution

Method used

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  • Monovalent copper electroless copper plating solution
  • Monovalent copper electroless copper plating solution
  • Monovalent copper electroless copper plating solution

Examples

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specific Embodiment approach 1

[0014] Specific embodiment one: the monovalent copper electroless copper plating solution of the present embodiment is prepared according to the following steps:

[0015] (1) Dissolve 40~120g / L of potassium chloride, 30~100mL / L of ammonia (25%~28%) and 5~60g / L of auxiliary complexing agent in deionized water, stir evenly, and obtain Solution A; (2) Dissolve 5~30mL / L formaldehyde (37%), 1~100mg / L stabilizer and 0.5~20.0g / L antioxidant in solution A, and adjust with hydrochloric acid or potassium hydroxide When the pH value reaches 11.0~13.5, prepare solution B; (3) Weigh cuprous chloride 5~30g / L, slowly add it into solution B and stir until dissolved, and prepare monovalent copper electroless copper plating solution after aging for 24 hours .

[0016] When the monovalent copper electroless copper plating solution of this embodiment is heated to a suitable temperature and there is a catalytically active interface, the catalytically active interface can catalyze the oxidation of...

specific Embodiment approach 2

[0017] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the auxiliary complexing agent described in step (1) is ethylenediamine, trisodium citrate, disodium edetate, sodium gluconate, three One or a combination of ethanolamine, potassium sodium tartrate or sodium glutamate, the concentration is 6~50g / L. Others are the same as in the first embodiment.

[0018] When the auxiliary complexing agent of this embodiment is a composition, various auxiliary complexing agents are combined in arbitrary ratios.

specific Embodiment approach 3

[0019] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the stabilizer described in step (2) is thiourea, 2,2-bipyridyl, polyethylene glycol (molecular weight 6000), Tween 80 Or the combination of two kinds of potassium thiocyanate, the two stabilizers are combined in any ratio, and the concentration is 2~80mg / L. Others are the same as in the first or second embodiment.

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Abstract

Monovalent copper electroless copper plating solution, the invention relates to the preparation and use method of monovalent copper electroless copper plating solution. The invention aims to solve the technical problems of low electroless copper plating speed and high consumption of formaldehyde at present. The monovalent copper electroless copper plating solution contains components such as cuprous chloride, potassium chloride, ammonia water, auxiliary complexing agent, formaldehyde, stabilizer, and antioxidant. It needs to be heated to 40~70°C and the loading capacity is 0.2 ~4.0dm2 / L. The electroless copper plating solution for monovalent copper of the present invention can deposit more metal copper under the condition of consuming equivalent formaldehyde, not only can improve the plating speed of electroless copper plating, but also can save the amount of formaldehyde used, which is beneficial to the improvement of production efficiency Improve and control production costs.

Description

technical field [0001] The invention belongs to the field of electroless copper plating, and relates to a method for preparing and using a monovalent copper electroless copper plating solution. Background technique [0002] With the rapid development of society, a single metal material or non-metal material can no longer meet people's needs. In order to combine the characteristics of lightness and insulation of non-metallic materials with the characteristics of gloss and conductivity of metals, the conductive treatment of non-metallic materials has become an important research field of modern material science and technology. In the process of conductive treatment of non-metallic materials, electroless copper plating is usually used as the first step, which can provide an initial continuous and uniform conductive substrate for subsequent complete and excellent conductive plating. Since the electroless copper plating using formaldehyde as a reducing agent not only has a lower...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/40
Inventor 田栋郑香丽周长利刘姗花小霞夏方诠
Owner UNIV OF JINAN
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