BGA substrate multilayer interconnection structure and method based on selective aluminum anodic oxidation

Abstract

The invention discloses a BGA substrate multilayer interconnection structure and method based on selective aluminum anodization. The upper layer aluminum thin film multilayer interconnection structure and the lower layer aluminum substrate perforated metallization structure are manufactured by using the selective aluminum anodization process. The upper layer aluminum Several conduction bands in the tantalum-aluminum alloy film of the thin-film multilayer interconnection structure are electrically connected to several conduction bands in the aluminum film respectively; Electrically connected separately; several conduction bands of the tantalum-aluminum alloy film deposited on the perforated metallization structure of the lower aluminum substrate are electrically connected to the upper ends of several aluminum through-pillars respectively, which simplifies the manufacturing process of the BGA substrate and reduces the cost of the BGA substrate. cost and improve the stability of the interconnection structure.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a BGA substrate multilayer interconnection structure and a manufacturing method based on a selective aluminum anodic oxidation process. Background technique [0002] BGA package, namely ball grid array package, is a new type of surface mount large-scale integrated circuit package. Compared with QFP (Quad Flat Package), it realizes the large-scale integrated circuit from four-side lead package to ball grid array package. The BGA package has the following notable features: BGA package provides a high number of I / O terminals, which is suitable for MCM package and realizes the high density of MCM; BGA package makes the signal path short, reduces parasitic inductance and capacitance, and improves electrical performance; BGA package The coplanar nature of the package and the "self-alignment" effect of the surface tension of the solder balls when they melt improve interc...

AI Technical Summary

Problems solved by technology

Although the sensitivity to moisture and the matching with the CTE of the chip have been solved, for high-power chip packaging and high-frequency device packaging, poor heat dissipation characteristics and large shrinkage are the main features, which limits its use in high-power and high-frequency device packaging. Especially in CBGA packaging, assembly problems of CBGA-FR4 substrates, CTE mismatch and elastic modulus difference, large stress on solder joints, and short thermal fatigue life

Images