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Low resin fluidity prepreg and preparation method thereof

A resin fluidity, prepreg technology, applied in the field of copper clad laminates, can solve problems such as difficult use requirements, poor adhesion of polyimide surfaces, and limited improvement in bonding, and achieve improved heat resistance, processing toughness, and high flexibility. performance and bond strength, cost reduction effect

Active Publication Date: 2014-11-26
VENTEC ELECTRONICS SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing low resin fluidity prepreg mainly has the following problems: the one, although the polyimide modified epoxy resin system has improved heat resistance, reliability and processing toughness, there is a comparison with the polyimide surface binding force. Poor problems generally require plasma treatment of the polyimide surface before PCB processing to improve adhesion. Even so, the improvement in adhesion is limited, and it is difficult to meet the requirements for higher performance PCBs; system, has different compatibility with materials such as rubber or thermoplastic polymers, which often leads to more difficult formulation design, and the matching with the core board will also bring certain difficulties

Method used

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  • Low resin fluidity prepreg and preparation method thereof
  • Low resin fluidity prepreg and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] 1. Weigh 100kg of B920, 50kg of 912A and 15kg of P59 into a 500ml container and mix thoroughly, react at 130°C for about 60min, and add 15kg of MEK to dissolve the solid after the reaction is completed;

[0031] 2. After the above solids are completely dissolved, add 10kg of 705 and the remaining MEK, stir for more than 2 hours, and mix well to form a glue with a resin content of 60%;

[0032] 3. Immerse the above glue on 1080 electronic grade glass fiber cloth, put it into an oven at 150-170°C and bake for 6-8 minutes, so that the glue is semi-cured to B-stage, and the low resin fluidity is obtained. prepreg.

Embodiment 2

[0034] 1. Weigh 100kg of B920, 50kg of 912A and 15kg of P59 into a 500ml container, react at 130°C for about 60 minutes, and add 15kg of MEK to dissolve the solid after the reaction is completed;

[0035] 2. After the above solids are completely dissolved, add 15kg of 705 and the remaining MEK, stir for more than 2 hours, and mix well to form a glue with a resin content of 60%;

[0036] 3. Immerse the above glue on 1080 electronic grade glass fiber cloth, put it into an oven at 150-170°C and bake for 6-8 minutes, so that the glue is semi-cured to B-stage, and the low resin fluidity is obtained. prepreg.

Embodiment 3

[0038] 1. Weigh 100kg of B920, 50kg of 912A and 15kg of P59 into a 500ml container, react at 130°C for about 60min, and add 15kg of MEK to dissolve the solid after the reaction is completed;

[0039] 2. After the above solids are completely dissolved, add 20kg of 705, 15kg of spherical silica and the remaining MEK, stir for more than 2 hours, and mix well to form a glue with a resin content of 60%;

[0040] 3. Immerse the above glue on 1080 electronic grade glass fiber cloth, put it into an oven at 150-170°C and bake for 6-8 minutes, so that the glue is semi-cured to B-stage, and the low resin fluidity is obtained. prepreg.

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Abstract

The invention provides a low resin fluidity prepreg, which has an enhanced material and thermosetting resin composition, the enhanced material is electronic grade glass fiber cloth, and the thermosetting resin composition is composed of 100 parts of bimaleimide resin, 30-60 parts of allyl compound, 10-30 parts of bisphenol A epoxy resin, 5-20 parts of epoxy resin containing a biphenyl structure unit, 0-20 parts of inorganic filling material and 10-45 parts of solvent. The low resin fluidity prepreg has the advantages of high flexibility and bonding strength, no glue flowing condition, and long-term preservation, the disadvantages that reliability of a rigid-flex combined printed circuit board made by the same kind products is decreased due to low bonding degree of the same kind products can be solved, the transition temperature of the solidified glass can reach as high as more than 200 DEG C, so that the heat resistance and processing toughness of the rigid-flex combined printed circuit board are increased.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, and in particular relates to a low resin fluidity prepreg applied to rigid-flex printed circuit boards and a preparation method thereof. Background technique [0002] With the development of electronic equipment in the direction of miniaturization and multi-function, high-density and high-performance PCBs are required at the same time. In order to realize three-dimensional installation of electronic products, more and more rigid-flexible technology is considered. The development of flexible bonded board is getting faster and faster. Low resin fluidity prepreg (No flow prepreg), compared with ordinary FR-4 adhesive sheet (prepreg), its B-stage resin does not flow glue or rarely flows glue under high temperature and high pressure, and at the same time has good adhesion and other properties , suitable for connecting rigid PCB boards and flexible PCB boards as a connecting material, so...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L63/00C08K7/00C08K7/14C08K7/18C08K9/06C08K3/36C08J5/04
CPCC08J5/043C08J2379/08C08J2463/00C08L79/085C08L2201/08C08L2203/20C08L2205/025C08L2205/03C08L63/00C08K7/14C08K7/18C08K9/06C08K3/36
Inventor 张沛
Owner VENTEC ELECTRONICS SUZHOU
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