Electromechanical-thermal coupling design method of active phased array antenna cold plate based on device location
Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIDIAN UNIV
- Publication Date
- 2017-02-08
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Abstract
Description
technical field
[0001] The invention relates to the technical field of radar antennas, in particular to an electromechanical thermal coupling design method for an active phased array antenna cold plate based on device positions, which can be used to guide the cold plate design, electromechanical thermal coupling performance analysis and evaluation of the active phased array antenna. Background technique
[0002] With the demand for high gain, high power, and light weight of active phased array antennas, its heat flux continues to increase. Thousands of T / R components are densely covered on the array of active phased array antennas, the thermal power is very high, and the performance of T / R components is very sensitive to temperature. The unreasonable temperature distribution of the array will seriously affect the amplitude and phase control accuracy of the antenna array, and the temperature distribution will cause structural deformation, thereby changing the pattern of the a...