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Concave dual-electrode integrated chip high-voltage ceramic capacitor and manufacturing process thereof

A high-voltage ceramic and double-electrode technology, which is applied in the direction of fixed capacitor dielectric and fixed capacitor parts, can solve the problems of large volume and unfavorable assembly of power devices, so as to reduce the volume, improve the nominal capacitance and compressive strength, The effect of high electric strength

Inactive Publication Date: 2014-11-26
鞍山奇发电子陶瓷科技有限公司 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional disc-type ceramic capacitors are relatively large in size, which is not conducive to the assembly of power devices

Method used

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  • Concave dual-electrode integrated chip high-voltage ceramic capacitor and manufacturing process thereof
  • Concave dual-electrode integrated chip high-voltage ceramic capacitor and manufacturing process thereof
  • Concave dual-electrode integrated chip high-voltage ceramic capacitor and manufacturing process thereof

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Embodiment Construction

[0025] The specific embodiment of the present invention is further described below in conjunction with accompanying drawing:

[0026] As shown in Figures 1 to 2, a concave double-electrode integrated chip high-voltage ceramic capacitor includes a resin encapsulation layer 1, an electrode layer, a ceramic dielectric chip 4 and a lead wire 5, and the overall shape is a centrally symmetrical concave dish shape. That is, the center is disc-shaped, and the outside is circular. The disc-shaped and circular-shaped chips form a whole chip. The thickness of the outer circular-shaped chip is greater than that of the central circular-shaped chip. The surface of the circular-shaped chip is provided with external electrodes 2 , the surface of the disk-shaped chip is provided with an internal electrode 3, and the external electrode 2 and the internal electrode 3 are integral copper electrodes. 4 wrapped inside.

[0027] The preparation process of the above-mentioned capacitor includes the ...

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Abstract

The invention relates to a concave dual-electrode integrated chip high-voltage ceramic capacitor and a manufacturing process thereof. The overall shape of the capacitor is a centrosymmetric concave disc, in other words, the center of the capacitor is in the shape of a disc, the outer side of the capacitor is annular, the annular portion of the outer side is thicker than the disc at the center, an outer electrode is arranged on the surface of an annular chip, an inner electrode is arranged on the surface of a disc-shaped chip, the inner electrode and a lead are welded together, and the inner electrode, the outer electrode and a ceramic medium chip are wrapped in a resin-encapsulating layer. The capacitor manufacturing process comprises the steps of manufacturing of a dual-electrode concave copper electrode chip, lead welding, coating, printing and testing. By the adoption of the concave dual-electrode integrated chip high-voltage ceramic capacitor and the manufacturing process thereof, rated capacitance and voltage strength are effectively improved, the contradiction between rated capacitance and voltage strength is effectively resolved, the size of the capacitor is reduced greatly on the premise that high capacity and high electric strength of the capacitor are guaranteed, and the requirement for miniaturization of a complete electronic machine is met.

Description

technical field [0001] The invention relates to the field of ceramic capacitors, in particular to a concave double-electrode integrated chip high-voltage ceramic capacitor and its manufacturing process. Background technique [0002] Traditional discrete components—ceramic capacitors are mainly in the form of discs. This structure is simple to form, mature in technology, easy to operate, and convenient for batch and large-scale production. But for high-voltage ceramic capacitors, the main consideration is that the withstand voltage strength and nominal capacitance are as high as possible. And the two are contradictory. Under the same conditions: the thinner the dielectric, the larger the capacitance and the lower the compressive strength, and vice versa. Traditional disc-type ceramic capacitors are relatively bulky, which is not conducive to the assembly of power devices. Contents of the invention [0003] The technical problem to be solved by the present invention is to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/002H01G4/12
Inventor 史宝林范垂旭于金龙
Owner 鞍山奇发电子陶瓷科技有限公司
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