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Flushing treatment device for wafers after slicing machine wire breakage

A processing device and slicer technology, applied to fine working devices, working accessories, stone processing equipment, etc., can solve the problems of wasting time, high cost, product loss, etc., achieve low fragmentation rate, reduce production cost, and improve production The effect of efficiency and effectiveness

Inactive Publication Date: 2014-12-10
BEIJING JINGYI GRP ZHUOLU SOLAR CELL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, it is known that the mortar pipe of the pv800 slicer cannot spray the mortar. After the slicer is disconnected, the silicon wafer can only be cleaned with a water pipe.
However, flushing with a water hose will cause uneven force, or the flushing will not be clean
Cause a lot of product loss, or waste a lot of time and the effect is very unsatisfactory
Large losses and high costs after disconnection

Method used

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  • Flushing treatment device for wafers after slicing machine wire breakage
  • Flushing treatment device for wafers after slicing machine wire breakage
  • Flushing treatment device for wafers after slicing machine wire breakage

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Embodiment Construction

[0017] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0018] A device for washing and processing wafers after the microtome is disconnected, such as Figure 1 to Figure 3 As shown, it includes a rectangular groove 1, a stainless steel outer tube 2, a stainless steel inner tube 3 and more than two small holes 5, the groove surface of the rectangular groove 1 has a large annular hole 6, and the stainless steel outer tube 2 passes through Connect with the rectangular groove 1 through the annular large hole 6, the stainless steel inner tube 3 is nested in the stainless steel outer tube 2, and welded with the stainless steel outer tube 2, the small hole 5 is uniform Distributed on the stainless steel inner tube 3.

[0019] The device for rinsing and processing wafers after...

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Abstract

The invention relates to a flushing treatment device for wafers after slicing machine wire breakage. The device comprises a rectangular groove, a stainless steel outer tube, a stainless steel inner tube and two or more small holes. An annular big hole is formed in the face of the rectangular groove, and the stainless steel outer tube is connected with the rectangular groove via penetrating through the annular big holes. The stainless steel inner tube is embedded into the stainless steel outer tube in a welded mode, and the small holes are evenly distributed in the stainless steel inner tube. The advantages of the device are used, so that the wafers in slicing are rapidly flushed cleanly, the wafer breakage rate is low, production efficiency is improved, production benefits are increased, and the production cost is reduced.

Description

technical field [0001] The invention relates to a device for washing and processing wafers after a slicer is disconnected, and belongs to the field of the solar photovoltaic industry in the semiconductor industry. Background technique [0002] At present, it is known that the mortar pipe of the pv800 slicer cannot spray the mortar, and after the slicer breaks, the silicon wafer can only be cleaned with a water pipe. However, flushing with a water hose will be uneven, or the flushing will not be clean. Cause a lot of product loss, or waste a lot of time and the effect is very unsatisfactory. After causing the disconnection, the loss is large and the cost is high. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a device for rinsing and processing wafers after a slicer is disconnected, which improves production efficiency and benefits and reduces production costs. [0004] The technical scheme of the present inve...

Claims

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Application Information

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IPC IPC(8): B28D7/02B28D5/04
Inventor 张红光刘猛赵兵林哲李书声
Owner BEIJING JINGYI GRP ZHUOLU SOLAR CELL MATERIALS