Vacuum high-temperature defoaming method and device for polyamic acid resin salivation film

Abstract

The invention relates to a vacuum high-temperature defoaming method and device for a polyamide acid resin casting liquid film. The vacuum high-temperature defoaming method is characterized in that a casted polyamide acid resin liquid film is sequentially subjected to vacuum high-temperature treatment and drying treatment to form a polyamide acid film having a self-supporting property, wherein in the vacuum high-temperature treatment, the temperature is 40-166 DEG C, the negative pressure is -0.1-0MPa, and the time lasts for 0.1-3 minutes. The vacuum high-temperature defoaming device is characterized in that a closed vacuum high-temperature box is arranged between a shaping mold and a casting drying box; a heating device is mounted in the casting drying box; a box body is provided with a vacuum joint, and the vacuum joint is connected with a draught fan or a vacuum pump through a pipeline; a steel tape belt inlet and a steel belt outlet respectively formed in front and back of the vacuum high-temperature box are formed in the same horizontal plane with a steel belt inlet of the casting drying box; a steel belt carrying the casted liquid film firstly passes through the vacuum high-temperature box and then enters the casting drying box; a tag vacuum chamber is formed in back of the shaping mold and is used for smoothly bonding the liquid film to the steel belt. According to the vacuum high-temperature defoaming method, tiny bubbles are completely eliminated, so that the quality of the polyimide film is improved; the vacuum high-temperature defoaming device is simple and is convenient to operate.

Description

technical field [0001] The invention relates to a polyimide film manufacturing technology, in particular to a vacuum high-temperature defoaming method and device for a polyamic acid resin salivating liquid film. Background technique [0002] Polyimide film is a polymer material with excellent properties such as high strength, high toughness, wear resistance, high temperature resistance, and corrosion resistance. It is widely used in the electrical and electronic industries, especially in various high-end electronic products in the electronics industry. main base material. [0003] With the development trend of light, thin, short, small and high-reliability design of downstream electronic products, the polyimide film demanded by the market tends to be thinner, and the polyimide film with a thickness of ≤12.5 μm is favored to reduce The weight and volume of downstream products using polyimide film as a small substrate. Since the density of the downstream product wiring reach...

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Problems solved by technology

[0007] There is no effective defoaming method and device for polyamic acid resin salivation film at present

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