Process for manufacturing electroless copper electroplating via hole type double-sided circuit board through UV printing method

Abstract

The invention provides a process for manufacturing electroless copper electroplating via hole type double-sided circuit board through the UV printing method. The process comprises the following processes: cutting a plate; drilling a hole by a CNC (Computerized Numerical Control) manner; performing electroless copper electroplating; filling the hole and printing through UV; printing circuit through UV; etching/ erasing ink; performing solder masking printing through UV; printing characters through UV; moulding; processing a V-shaped groove; conducting to test; processing the surface; examining a finished product; packaging and delivering. According to the technical scheme, the process has the advantages that the material cost is small, the processing can be quickly performed, the process is simple, less defective products are produced, the processing efficiency is high, and automatic liner mass production applies.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a process for manufacturing double-sided circuit boards with sinking copper electroplating via holes by a UV printing method. Background technique [0002] As we all know, printed circuit boards (PCBs) are widely used as the basic material of the electronics industry. As small as electronic watches, calculators, personal computers, as large as computers, communication equipment, medical equipment, and aerospace or military equipment, as long as there are electronic components such as integrated circuits, PCBs are used for electrical interconnection between them. [0003] Existing double-sided circuit boards use double-sided copper-clad laminates on the copper foil layer for parallel exposure and development to make circuits. The process includes cutting boards—CNC drilling—copper plating—dry film. Development—etching. Ink removal—solder resist coating. Prebaking—e...

AI Technical Summary

Problems solved by technology

[0003] Existing double-sided circuit boards use double-sided copper-clad laminates on the copper foil layer for parallel exposure and development to make circuits. The process includes cutting boards—CNC drilling—copper plating—dry film. Development—etching. Ink removal—solder resist coating. Prebaking—exposure. Development. High temperature baking—baking character printing—forming—processing V-groove—conduction test—surface treatment—finished product inspection—shipment inspection and other steps, the process mainly has the following defects: ①There are many and cumbersome processes, many processing hours, and high processing costs, and a large amount of expensive double-panel production equipment and a large amount of manpower must be invested; , the cost of baked text materials is very high compared with VU printing materials

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