Active cooling type PCB (printed circuit board)

A PCB board and active heat dissipation technology, applied in the direction of printed circuit components, etc., can solve the problems of untimely heat dissipation and unsatisfactory heat dissipation effect, so as to eliminate any possible influence, improve heat dissipation effect, and ensure the effect of space volume

Inactive Publication Date: 2014-12-31
SUZHOU HEXINMEI ELECTRONICS SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The PCB board designed with this structure can achieve the effect of heat dissipation, but this way of heat dissipation is passively dependent on the convection of the air, and the heat dissipation effect is not ideal. For the long-term use of the PCB board, it is impossible to dissipate heat in time to achieve Ideal cooling effect

Method used

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  • Active cooling type PCB (printed circuit board)
  • Active cooling type PCB (printed circuit board)

Examples

Experimental program
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Embodiment Construction

[0022] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0023] like figure 1 As shown, the present invention designs an active heat dissipation PCB board, including a circuit wire layer 1, an insulating layer 2, a heat conduction layer 3 and a substrate 4 arranged sequentially from top to bottom, and the circuit wire layer 1 includes an external power supply access point; Also comprise at least one miniature fan 5, on the edge of described heat conduction layer 3 there is at least one heat conduction sheet 6 extending outwards, the quantity of heat conduction sheet 6 is consistent with the quantity of miniature fan 5, and the material of heat conduction sheet 6 and heat conduction layer The materials of 3 are consistent; each miniature fan 5 is arranged on the heat conducting sheet 6 respectively, and each miniature fan 5 is connected with the external power supply access po...

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PUM

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Abstract

The invention relates to an active cooling type PCB (printed circuit board). The active cooling type PCB comprises a circuit wire layer (1), an insulating layer (2), a heat conduction layer (3) and a substrate (4) which are arranged sequentially from top to bottom, and the circuit wire layer (1) comprises external power connection points; the active cooling type PCB also comprises at least one miniature fan (5), the edge of the heat conduction layer (3) is provided with at least one heat conduction plate (6) which extends outwards, the miniature fans (5) are respectively arranged on the heat conduction plates (6), and each miniature fan (5) is connected with one external power connection point on the circuit wire layer (1). The active cooling type PCB designed by the invention is the improvement for the structures of conventional PCBs, solves the problem of insufficient cooling of conventional PCBs and realizes active cooling, and cooling efficiency is greatly increased, and therefore the working efficiency of the PCB is ensured.

Description

technical field [0001] The invention relates to an active heat dissipation PCB board. Background technique [0002] PCB board is printed circuit board, also known as printed circuit board, printed circuit board, circuit board for short, with insulating board as the base material, cut to a certain size, with at least one conductive pattern attached to it, and holes (such as component Holes, fastening holes, metallized holes, etc.), used to replace the chassis of electronic components installed in the past, and realize the interconnection between electronic components. Because this kind of board is made by electronic printing, it is called "printed" circuit board; according to the number of layers of circuit boards, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. Since the printed circuit board is not a general terminal product, the definition of the name is slightly confusing. They ar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
Inventor 胡国良
Owner SUZHOU HEXINMEI ELECTRONICS SCI & TECH CO LTD
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