Band saw cutting device for machining superhard materials

Abstract

The invention relates to a belt saw cutting device for machining of ultra-hard materials. According to the belt saw cutting device for machining of the ultra-hard materials, a rotary main shaft is installed in a working table base in a rotary mode, a lower rotary connecting block is fixed to the upper surface of the working table base, an upper rotary connecting block is installed on the upper surface of the lower rotary connecting block in a rotary mode through a surface bearing, the lower surface of the upper rotary connecting block is fixed to the upper end face of the rotary main shaft, and a swing working table is fixed to the upper surface of the upper rotary connecting block; a main shaft sleeve is fixed to the side wall of the working table base, a transmission main shaft is installed in the main shaft sleeve in a rotary mode, a rotary table is fixed to the upper end of the transmission main shaft, a first pin shaft is eccentrically fixed to the upper surface of the rotary table, a connecting rod is installed to the upper end of the first pin shaft in a rotary mode, a second pin shaft is eccentrically fixed to the lower surface of the swing working table, and the other end of the connecting rod is installed at the lower end of the second pin shaft in a rotary mode. By the adoption of the belt saw cutting device for machining of the ultra-hard materials, the problem that a rotary belt saw is damaged or a crystal cracks due to saw blade deviation caused by rotary feeding is solved, and cutting and machining quality can be improved.

Description

technical field [0001] The invention relates to a cutting device, in particular to a band saw cutting device for superhard material processing. Background technique [0002] With the needs of industrial development and the continuous breakthrough and innovation of material science, various new materials with high strength, high hardness, corrosion resistance and high temperature resistance have emerged as the times require. Among them, those composite materials with high strength, superhardness, and high brittleness are called superhard materials. General superhard materials include artificial diamond, artificial sapphire single crystal, cubic boron nitride, diamond-like film, etc., which are widely used in mechanical processing, aerospace, new material processing and other fields due to their unparalleled wear resistance and other excellent properties. With the continuous achievement of superhard materials, their applications have gradually expanded from mechanical and phy...

AI Technical Summary

Problems solved by technology

The traditional band saw cutting method generally adopts the method of rotating the saw blade and feeding the workpiece, or using the method of fixing the workpiece and feeding the saw blade while rotating. The above two cutting methods process large-sized sapphire crystal blanks. When the cutting surface quality and flatness are relatively poor

In order to solve the above problems, the method of fixing the saw blade and feeding the workpiece while rotating is generally used at present. Although this method can improve the quality of the cutting surface, the band saw feeds in a rotating manner. Due to the irregular appearance of the crystal material, It is easy to cause the band saw to deviate, resulting in damage to the band saw or crystal cracking; in the process of rotary cutting, since the circular cutting area is getting smaller and smaller, in order to ensure the cutting quality, when the circular cutting area is small enough to a certain size, it is necessary to Reduce the rotation speed and feed speed of the workpiece, which leads to a smaller volume of material cut by the band saw per unit time, resulting in lower cutting efficiency; since the rotary cutting starts from the outside of the crystal and gradually extends to the center of the crystal, the saw blade cannot be cut directly For crystal materials, it is necessary to lightly tap with a hard rubber hammer to remove the remaining margin after the crystal is cut, which often leads to chipping of the crystal

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